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Uued standardid
IEC 61643-312:2013
Hind 107,53 EUR
Components for low-voltage surge protective devices - Part 312: Selection and application principles for gas discharge tubes
IEC 61643-312:2013 is applicable to gas discharge tubes (GDT) used for overvoltage protection in telecommunications, signalling and low-voltage power distribution networks with nominal system voltages up to 1 000 V (r.m.s.) a.c. and 1 500 V d.c. They are defined as a gap, or several gaps with two or three metal electrodes hermetically sealed so that gas mixture and pressure are under control. They are designed to protect apparatus or personnel, or both, from high transient voltages. This standard provides information about the characteristics and circuit applications of GDTs having two or three electrodes. This standard does not specify requirements applicable to complete surge protective devices, nor does it specify total requirements for GDTs employed within electronic devices, where precise coordination between GDT performance and surge protective device withstand capability is highly critical. Keywords: gas discharge tubes (GDT), overvoltage protection in telecommunications, signa
IEC 60749-26:2013
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Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 60749-26:2013 establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. The HBM and MM test methods produce similar but not identical results; unless otherwise specified, this test method is the one selected. This edition includes the following significant technical changes with respect to the previous edition:
IEC/TR 62240-1:2013
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Process management for avionics - Electronic components capability in operation - Part 1: Temperature uprating
IEC/TR 62240-1:2013(E) provides information for the use of semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers' specifications. This technical report describes the methods and processes for implementing this special case. All of the elements of these methods and processes employ existing, commonly used best engineering practices. IEC/TR 62240-1 includes the following significant changes with respect to IEC/TR 62240:
- revised wording, clarifications and corrections;
- removal of all requirements;
- updated paragraphs, including addition of references to the utilization of samples from a single lot, and the fact that performance of uprating is repeated if significant changes are implemented by device manufacturer, as well as the reference that the manufact
IEC 61954/Amd 1:2013
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Amendment 1 - Static var compensators (SVC) - Testing of thyristor valves
IEC 61954:2013
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Static var compensators (SVC) - Testing of thyristor valves
IEC 61954:2011+A1:2013 defines type, production and optional tests on thyristor valves used in thyristor controlled reactors (TCR), thyristor switched reactors (TSR) and thyristor switched capacitors (TSC) forming part of static VAR compensators (SVC) for power system applications. The requirements of the standard apply both to single valve units (one phase) and to multiple valve units (several phases). This edition includes the following significant technical changes with respect to the previous edition:
a) Definitions of terms "thyristor level", "valve section", "valve base electronics" and "redundant thyristor levels" have been changed for clarification;
b) Conditions of testing thyristor valve sections instead of a complete thyristor valve have been defined;
c) The requirement has been added that if, following a type test, one thyristor level has become short-circuited, then the failed
IEC 61189-11:2013
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
IEC 60747-5-5/Amd 1:2013
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Amendment 1 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
IEC 60747-5-5:2013
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Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
IEC 60747-5-5:2007+A1:2013 gives the terminology, essential ratings, characteristics, safety test as well as the measuring method for photocouplers (or optocouplers). NOTE The word "optocoupler" can also be used instead of "photocoupler". This standard replaces the clauses for photocouplers (or optocouplers) described in IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, including their amendments. The contents for phototransistors and photothyristors in IEC 60747-5-1, IEC 60747-5-2 and IEC 60747-5-3, including their amendments, will be considered obsolete as of the effective date of publication of this standard. NOTE Photocouplers that are certified to the previous version of the photocoupler standard, namely IEC 60747-5-1/2/3, are to be considered in compliance with the requirements and provisions of IEC 60747-5-5. This consolidated version consists of the first edition (2007) and its amendment 1 (2013). Therefore, no need to order amendment in addition to this publication.<
EVS-EN 61193-3:2013
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Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing (IEC 61193-3:2013)
This part of IEC 61193 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein permit the use of different sampling plans that may be applied to an individual attribute or set of attributes, according to classification of importance with regard to form, fit and function.
EVS-EN 61587-3:2013
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Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks (IEC 61587-3:2013)
This part of IEC 61587 specifies the tests for empty cabinets and subracks concerning electromagnetic shielding performance, in the frequency range of 30 MHz to 2 000 MHz. Stipulated attenuation values are chosen for the definition of the shielding performance level of cabinets and subracks for the IEC 60297 and IEC 60917 series. The shielding performance levels are chosen with respect to the requirements of the typical fields of industrial application. They will support the measures to achieve electromagnetic compatibility but cannot replace the final testing of compliance of the equipped enclosure. The purpose of this standard is to ensure physical integrity and environmental performance of cabinets and subracks, taking into account the need for different levels of performance in different applications. It is intended to give the user a level of confidence in the selection of products to meet his specific needs. This standard in whole or part applies only to the empty enclosures, for example cabinets and subracks according to IEC 60297 and IEC 60917 and does not apply to the enclosures when electronic equipment is installed. This standard was developed in close relationship to IEC 61000-5-7 but with the specific focus on subracks and cabinets and the determination of performance levels at the chosen frequency range.
EVS-EN 61169-26:2013
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Radio-frequency connectors - Part 26: Sectional specification of TNCA series RF coaxial connector (IEC 61169-26:2013)
This part of IEC 61169 which is a sectional specification (SS) provides information and rules for the preparation of detail specifications (DS) for TNCA series RF coaxial connectors, with characteristic impedance of 50 Ω, with threaded coupling and operating frequency limit up to 18 GHz, used in wireless, communication, instrument, antenna, test and measurements, radar, and other fields, connecting with RF cables or micro-strips. It also prescribes mating face dimensions for general connectors-grade 2, dimensional details of standard test connectors-grade 0, gauging information and tests selected from IEC 61169-1, applicable to all detail specifications relating to TNCA series connectors. This specification indicates the recommended performance characteristics to be considered when writing a detail specification and it covers test schedules and inspection requirements for assessment levels M and H (see Tables 8 and 9). TNCA connectors are recommended for applications above 11 GHz. TNCA connectors are compatible with TNC connectors as described in the IEC 60169-17 and IEC 60169-26 provided that the dielectric of connector with socket-centre contact does not extend beyond reference plane. However when mated with these connectors, the performances are not ensured. NOTE Attention is drawn to the fact that TNCA interface does not utilize overlapping PTFE dielectric for increased voltage breakdown resistance.
Asendatud või tühistatud standardid
EVS-EN 61587-3:2006
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 -- Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks
This part of IEC 61587 specifies the tests for empty cabinets and subracks concerning electromagnetic shielding performance, in the frequency range of 30 MHz to 2 000 MHz. Stipulated attenuation values are chosen for the definition of the shielding performance level of cabinets and subracks for the IEC 60297 and IEC 60917 series. The shielding performance levels are chosen with respect to the requirements of the typical fields of industrial application. They will support the measures to achieve electromagnetic compatibility but cannot replace the final testing of compliance of the equipped enclosure. The purpose of this standard is to ensure physical integrity and environmental performance of cabinets and subracks, taking into account the need for different levels of performance in different applications. It is intended to give the user a level of confidence in the selection of products to meet his specific needs. This standard in whole or part applies only to the empty enclosures, for example cabinets and subracks according to IEC 60297 and IEC 60917 and does not apply to the enclosures when electronic equipment is installed.
Keel: Inglise
IEC 60749-26:2006
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Humanody model (HBM)
Establishes a standard procedure for testing and classifying semiconductor devices according to their susceptibility to damage or degradationy exposure to a defined humanody model (HBM) electrostatic discharge (ESD). The objective is to provide reliable, repeatable HBM ESD test results so that accurate classifications cane performed. This test method is applicable to all semiconductor devices and is classified as destructive.
Keel: Inglise
IEC/TR 62240:2005
Process management for avionics - Use of semiconductor devices outside manufacturers' specified temperature range
Reports processes that exist for using semiconductor devices in wider temperature ranges than those specifiedy the device manufacturer. Covers applications in avionics in which only the performance of the device is an issue. The wider temperature ranges wille limited to those that do not compromise the system performance or application-specific reliability of the device.
Keel: Inglise
Kavandite arvamusküsitlus
FprEN 62679-1-1
Identne IEC 62679-1-1:201X (110/457/CDV)
ja identne
FprEN 62679-1-1:2013
Tähtaeg 31.07.2013
Electronic paper displays - Part 1-1: Terminology
This part of IEC 62679 gives the preferred terms, their definitions, and symbols for Electronic paper displays (EPDs).
Keel: Inglise