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Uued standardid

EVS-EN 60384-13:2012
Hind 12,51 EUR
Fixed capacitors for use in electronic equipment - Part 13: Sectional specification - Fixed polypropylene film dielectric metal foil d.c. capacitors
This part of IEC 60384 applies to fixed direct current capacitors, using as dielectric a polypropylene film with electrodes of thin metal foils. The capacitors covered by this standard are intended for use in electronic equipment. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14.

IEC 60838-2-2/Amd 1:2012
Hind 11,52 EUR
Amendment 1 - Miscellaneous lampholders - Part 2-2: Particular requirements - Connectors for LED-modules


EVS-EN 60297-3-107:2012
Hind 14,69 EUR
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
This part of IEC 60297 defines the interface dimensions between subracks and associated plug-in units using connectors as defined in PICMG-MTCA.0 (Fixed board, see Figure 7) and IEC 61076-4-116 (Two part, see Figure 12) and other two part connectors, (see Figure 15). For mechanical and climatic tests refer to IEC 61587-1. For electromagnetic shielding performance tests refer to IEC 61587-3.

EVS-EN 62047-14:2012
Hind 10,19 EUR
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
This part of IEC 62047 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described herein are typically used in electric components, MEMS and microdevices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.

EVS-EN 60747-15:2012
Hind 12,51 EUR
Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
This part of IEC 60747 gives the requirements for isolated power semiconductor devices excluding devices with incorporated control circuits. These requirements are additional to those given in other parts of IEC 60747 for the corresponding non-isolated power devices.

EVS-EN 62047-13:2012
Hind 8,01 EUR
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
This part of IEC 62047 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. Micro-sized elements of MEMS devices are made up of laminated fine pattern films on a substrate, which are fabricated by deposition, plating, and/or coating with photolithography. MEMS devices include a large number of interfaces between dissimilar materials, at which delamination occasionally occurs during fabrication or in operation. Combination of the materials at the junction determines the adhesive strength; moreover, defects and residual stress in the vicinity of the interface, which are changing by processing condition, strongly affect the adhesive strength. This standard specifies the adhesive testing method for microsized- elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.

EVS-EN 61587-1:2012
Hind 12,51 EUR
Elektroonikaseadmete mehaaniline osa. Katsetused vastavalt standarditele IEC 60917 ja IEC 60297. Osa 1: Kastide, raamide, osaraamide ja aluste kliima- ja mehaanilised katsetused
This part of IEC 61587 specifies environmental requirements, test set-up, as well as safety aspects for empty enclosures, i.e. cabinets, racks, subracks and chassis under indoor conditions. The purpose of this standard is to establish defined levels of physical performance in order to meet certain requirements of storage, transport and final location conditions. It applies in whole or part only to the mechanical structures of cabinets, racks, subracks and chassis, but it does not apply to electronic equipment.

EVS-EN 60384-2:2012
Hind 13,22 EUR
Fixed capacitors for use in electronic equipment - Part 2: Sectional specification - Fixed metallized polyethylene terephthalate film dielectric d.c. capacitors
This part of IEC 60384 applies to fixed capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors may have “self-healing properties” depending on conditions of use. They are primarily intended for applications where the a.c. component is small with respect to the rated voltage. Two performance grades of capacitors are covered, Grade 1 for long-life application and Grade 2 for general application. Capacitors for electromagnetic interference suppression and surface mount fixed metallized polyethylene-terephthalate film dielectric d.c. capacitors are not included, but are covered by IEC 60384-14 and IEC 60384-19 respectively.

EVS-EN 61988-2-1:2012
Hind 14,69 EUR
Plasma display panels - Part 2-1: Measuring methods - Optical and optoelectrical
This part of IEC 61988 determines the following measuring methods for characterizing the performance of plasma display modules (PDP modules): a) four per cent (4 %) window luminance; b) luminance uniformity; c) dark-room contrast ratio; d) bright-room contrast ratio 100/70; e) white chromaticity and chromatic uniformity; f) colour gamut in the centre box; g) module power and current consumption; h) module power consumption using video signal; i) module luminous efficacy, and j) panel luminous efficacy.

EVS-EN 62341-6-2:2012
Hind 16,10 EUR
Organic light emitting diode (OLED) displays - Part 6-2: Measuring methods of visual quality and ambient performance
This part of IEC 62341 specifies the standard measurement conditions and measurement methods for determining the visual quality and ambient performance of organic light-emitting diode (OLED) display modules and panels. This document mainly applies to colour display modules.

EVS-EN 60384-21:2012
Hind 15,40 EUR
Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
This part of IEC 60384 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14.

EVS-EN 60384-22:2012
Hind 16,10 EUR
Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
This part of IEC 60384 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14.

Asendatud või tühistatud standardid

EVS-EN 60384-13:2006
Fixed capacitors for use in electronic equipment Part 13: Sectional specification - Fixed polypropylene film dielectric metal foil d.c. Capacitors
is applicable to fixed direct current capacitors, using as dielectric a polypropylene film with electrodes of thin metal foils. The capacitors covered by this standard are intended for use in electronic equipment.
Keel: Inglise

EVS-EN 60384-21:2005
Fixed capacitors for use in electronic equipment Part 21: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits.
Keel: Inglise

EVS-EN 60747-15:2004
Discrete semiconductor devices - Part 15: Isolated power semiconductor devices
Gives the product specific standards, requirements and test methods for isolated power semiconductor devices. These requirements are added to those given in other parts of IEC 60747, IEC 60748 and IEC 60749 for the corresponding non-isolated power devices.
Keel: Inglise

EVS-EN 61988-2-1:2003
Plasma display panels - Part 2-1: Measuring methods - Optical
Determines the measuring methods for characterizing the performance of colour plasma display modules in the following areas: 4 % window luminance; luminance uniformity; dark-room contrast ratio; white chromaticity and chromatic uniformity; colour gamut in the centre box.
Keel: Inglise

EVS-EN 61988-2-2:2003
Plasma display panels - Part 2-2: Measuring methods - Optoelectrical
Determines the following measuring methods for characterising the performance of colour plasma display modules: a) bright-room contrast ratio; b) module power and current consumption, c) module luminous efficacy
Keel: Inglise

EVS-EN 60384-22:2004
Fixed capacitors for use in electronic equipment Part 22: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits.
Keel: Inglise

EVS-EN 61587-1:2007
Elektroonikaseadmete mehaaniline osa. Katsetused vastavalt standarditele IEC 60917 ja IEC 60297. Osa 1: Kastide, raamide, osaraamide ja aluste kliima- ja mehaanilised katsetused
This part of IEC 61587 specifies mechanical tests, climatic tests and safety aspects for cabinets, racks, subracks and chassis as defined in the standards of the IEC 60917 series and the IEC 60297 series for indoor applications. It applies in whole or part only to the mechanical structures of cabinets, racks, subracks and chassis, but it does not apply to electronic equipment or systems. Tests dedicated to outdoor enclosures are standardized in IEC 61969-3. Some suitable parts of IEC 61587-1 apply to IEC 61969-3. The object of this standard is to ensure physical integrity and environmental performance in cabinets, racks, subracks and chassis, taking into account the need for different levels of performance in different applications. It is intended to give the user a level of confidence in the selection of performance levels to meet as close as possible the individual application requirements.
Keel: Inglise

Kavandite arvamusküsitlus

FprEN 60286-4
Tähtaeg 30.06.2012
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
Stick magazines (including end stoppers) are intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components.
Keel: Inglise

FprEN 61747-30-1
Tähtaeg 30.06.2012
Liquid crystal display devices - Part 30-1: Measuring methods for liquid crystal display modules - Transmissive type
This part of IEC 61747 is restricted to transmissive liquid crystal display-modules using either segment, passive or active matrix and achromatic or colour type LCDs. Furthermore, the transmissive modes of transflective LCD modules with backlights ON are comprised in this document. An LCD module in combination with a touch-panel or a front-light-unit is excluded from the scope because measurements are frequently inaccurate. Touch-panels or front-lightunits are removed before measurement. Throughout the main body of this standard, an integrated backlight is assumed to provide the illumination for the measurements. Deviations from this (e.g. segmented displays without integrated backlights) may usually be handled in the same way as display modules with integrated backlight, if an external backlight is provided. However, in the case where one of the two situations should be handled differently, this will be specifically stated.
Keel: Inglise

FprEN 61587-3
Tähtaeg 30.06.2012
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks
This part of IEC 61587 specifies the tests for empty cabinets and subracks concerning electromagnetic shielding performance, in the frequency range of 30 MHz to 2 000 MHz. Stipulated attenuation values are chosen for the definition of the shielding performance level of cabinets and subracks for the IEC 60297 and IEC 60917 series. The shielding performance levels are chosen with respect to the requirements of the typical fields of industrial application. They will support the measures to achieve electromagnetic compatibility but cannot replace the final testing of compliance of the equipped enclosure. The purpose of this standard is to ensure physical integrity and environmental performance of cabinets and subracks, taking into account the need for different levels of performance in different applications. It is intended to give the user a level of confidence in the selection of products to meet his specific needs. This standard in whole or part applies only to the empty enclosures, for example cabinets and subracks according to IEC 60297 and IEC 60917 and does not apply to the enclosures when electronic equipment is installed. This standard was developed in close relationship to IEC 61000-5-7 but with the specific focus on subracks and cabinets and the determination of performance levels at the chosen frequency range.
Keel: Inglise

FprEN 61747-2-1
Tähtaeg 30.06.2012
Liquid crystal display devices - Part 2-1: Passive matrix monochrome LCD modules - Blank detail specification
This part of IEC 61747 serves as a Blank Detail Specification (BDS) for a high quality approval system and contains requirements for style and layout and minimum content of detail specifications. These requirements are applicable when the detail specification is published (e.g. for standard product).
Keel: Inglise