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Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
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English
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Valid |
140.61 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
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English
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Valid |
57.90 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
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English
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Valid |
66.17 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
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English
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Valid |
41.36 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
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English
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Valid |
24.81 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
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English
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Valid |
82.71 EUR |
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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
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English
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Valid |
0.00 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
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English
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Valid |
157.15 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
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English
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Valid |
57.90 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
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English
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Valid |
140.61 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
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English
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Valid |
82.71 EUR |
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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
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English
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Valid |
0.00 EUR |
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Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
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|
English
|
Valid |
124.07 EUR |
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Semiconductor die products - Part 1: Procurement and use
Semiconductor die products - Part 1: Procurement and use
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|
English
|
Valid |
190.24 EUR |
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Semiconductor die products - Part 2: Exchange data formats
Semiconductor die products - Part 2: Exchange data formats
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English
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Valid |
231.60 EUR |
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Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
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English
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Valid |
41.36 EUR |
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Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
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English
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Valid |
28.95 EUR |
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Amendment 1 - DC or AC supplied electronic control gear for LED modules - Performance requirements
Amendment 1 - DC or AC supplied electronic control gear for LED modules - Performance requirements
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English
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Valid |
11.58 EUR |
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DC or AC supplied electronic control gear for LED modules - Performance requirements
DC or AC supplied electronic control gear for LED modules - Performance requirements
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|
English
|
Valid |
49.63 EUR |
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DC or AC supplied electronic control gear for LED modules - Performance requirements
DC or AC supplied electronic control gear for LED modules - Performance requirements
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|
English
|
Valid |
78.58 EUR |