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Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval)
Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval)
Vaata / Osta
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Inglise
|
Kehtiv |
16,10 EUR
251,91 EEK |
| |
Mechanical standardization of semiconductor devices -- Part 1: General rules for the preparation of outline drawings of discrete devices
Mechanical standardization of semiconductor devices -- Part 1: General rules for the preparation of outline drawings of discrete devices
Vaata / Osta
|
Inglise
|
Kehtiv |
16,10 EUR
251,91 EEK |
| |
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
Vaata / Osta
|
Inglise
|
Kehtiv |
19,05 EUR
298,07 EEK |
| |
Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Vaata / Osta
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Inglise
|
Kehtetu |
11,67 EUR
182,60 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Vaata / Osta
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Inglise
|
Kehtiv |
16,10 EUR
251,91 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Vaata / Osta
|
Inglise
|
Kehtiv |
6,47 EUR
101,23 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Vaata / Osta
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Inglise
|
Kehtiv |
9,49 EUR
148,49 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
Vaata / Osta
|
Inglise
|
Kehtetu |
8,72 EUR
136,44 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
Vaata / Osta
|
Inglise
|
Kehtiv |
10,90 EUR
170,55 EEK |
| |
Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
Mechanical standardization of semiconductor devices -- Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
Vaata / Osta
|
Inglise
|
Kehtiv |
11,67 EUR
182,60 EEK |
| |
Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Vaata / Osta
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Inglise
|
Kehtiv |
10,19 EUR
159,44 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Vaata / Osta
|
Inglise
|
Kehtiv |
13,22 EUR
206,85 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Vaata / Osta
|
Inglise
|
Kehtiv |
11,67 EUR
182,60 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Vaata / Osta
|
Inglise
|
Kehtiv |
8,72 EUR
136,44 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages -Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages -Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Vaata / Osta
|
Inglise
|
Kehtiv |
8,72 EUR
136,44 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-20: General rules forthe preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Mechanical standardization of semiconductor devices - Part 6-20: General rules forthe preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Vaata / Osta
|
Inglise
|
Kehtiv |
8,01 EUR
125,33 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-21: General rules forthe preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Mechanical standardization of semiconductor devices - Part 6-21: General rules forthe preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Vaata / Osta
|
Inglise
|
Kehtiv |
8,72 EUR
136,44 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6- 3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)
Mechanical standardization of semiconductor devices - Part 6- 3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quad flat packs (QFP)
Vaata / Osta
|
Inglise
|
Kehtiv |
10,19 EUR
159,44 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Vaata / Osta
|
Inglise
|
Kehtiv |
8,01 EUR
125,33 EEK |
| |
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Vaata / Osta
|
Inglise
|
Kehtiv |
8,72 EUR
136,44 EEK |