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Blank detail specification: Printed board assembly modular electronic units of assessed quality. Capability approval
Blank detail specification: Printed board assembly modular electronic units of assessed quality. Capability approval
Vaata / Osta
|
Inglise
|
Kehtetu |
10,90 EUR
170,55 EEK |
| |
Sectional Specification: Microwave modular electronic units of assessed quality - Part 1: Capability approval procedure
Sectional Specification: Microwave modular electronic units of assessed quality - Part 1: Capability approval procedure
Vaata / Osta
|
Inglise
|
Kehtetu |
17,08 EUR
267,24 EEK |
| |
Blank detail specification: Microwave modular electronic units of assessed quality - Capability Approval
Blank detail specification: Microwave modular electronic units of assessed quality - Capability Approval
Vaata / Osta
|
Inglise
|
Kehtetu |
8,72 EUR
136,44 EEK |
 |
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Vaata / Osta
|
Inglise
|
Kehtetu |
13,22 EUR
206,85 EEK |
| |
Environmental testing Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Environmental testing Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Vaata / Osta
|
Inglise
|
Kehtiv |
15,40 EUR
240,96 EEK |
| |
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallisation and to soldering heat of Surface Mounting Devices (SMD)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallisation and to soldering heat of Surface Mounting Devices (SMD)
Vaata / Osta
|
Inglise
|
Kehtetu |
10,90 EUR
170,55 EEK |
| |
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Vaata / Osta
|
Inglise
|
Kehtiv |
9,49 EUR
148,49 EEK |
| |
Environmental testing -- Part 2: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Environmental testing -- Part 2: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Vaata / Osta
|
Inglise
|
Kehtiv |
13,92 EUR
217,80 EEK |
| |
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
Vaata / Osta
|
Inglise
|
Kehtiv |
8,72 EUR
136,44 EEK |
| |
Environmental testing -- Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components
Environmental testing -- Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components
Vaata / Osta
|
Inglise
|
Kehtiv |
15,40 EUR
240,96 EEK |
| |
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance methodusing solder paste
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance methodusing solder paste
Vaata / Osta
|
Inglise
|
Kehtiv |
15,40 EUR
240,96 EEK |
| |
Printed board design, manufacture and assembly - Terms and definitions
Printed board design, manufacture and assembly - Terms and definitions
Vaata / Osta
|
Inglise
|
Kehtiv |
25,03 EUR
391,63 EEK |
| |
Complete filter units for radio interference suppression Part 2-1: Blank detail specification – Passive filter units for electromagnetic interference suppression – Filters for which safety tests are required (assessment level D/DZ)
Complete filter units for radio interference suppression Part 2-1: Blank detail specification – Passive filter units for electromagnetic interference suppression – Filters for which safety tests are required (assessment level D/DZ)
Vaata / Osta
|
Inglise
|
Kehtiv |
10,90 EUR
170,55 EEK |
| |
Complete filter units for radio interference suppression Part 2-2: Blank detail specification – Passive filter units for electromagnetic interference suppression – Filters for which safety tests are required (safety tests only)
Complete filter units for radio interference suppression Part 2-2: Blank detail specification – Passive filter units for electromagnetic interference suppression – Filters for which safety tests are required (safety tests only)
Vaata / Osta
|
Inglise
|
Kehtiv |
9,49 EUR
148,49 EEK |
| |
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Vaata / Osta
|
Inglise
|
Kehtiv |
20,74 EUR
324,51 EEK |
| |
Printed boards and printed board assemblies - Design and use Part 5-2: Attachment (land/joint) considerations - Discrete components
Printed boards and printed board assemblies - Design and use Part 5-2: Attachment (land/joint) considerations - Discrete components
Vaata / Osta
|
Inglise
|
Kehtiv |
18,00 EUR
281,64 EEK |
| |
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
Vaata / Osta
|
Inglise
|
Kehtiv |
11,67 EUR
182,60 EEK |
| |
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Vaata / Osta
|
Inglise
|
Kehtiv |
12,51 EUR
195,74 EEK |
| |
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
Vaata / Osta
|
Inglise
|
Kehtetu |
11,67 EUR
182,60 EEK |
| |
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Attachment materials for electronic assembly -- Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Vaata / Osta
|
Inglise
|
Kehtiv |
12,51 EUR
195,74 EEK |