IEC/TR 62453-502:2009

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• Field device tool (FDT) interface specification - Part 502: Communication implementation for common object model - IEC 61784 CPF 2

  Description:

  IEC/TR 62453-502:2009(E) is a technical report and provides information for integrating the CIP technology into the COMased implementation of FDT interface specification (IEC/TR 62453-5). Communication Profile Family 2 (commonly known as CIP^TM1) defines communication profilesased on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, and IEC 61158-6-2, IEC 62026-3. Theasic profiles CP 2/1 (ControlNet^TM2), CP 2/2 (EtherNet/IP^TM3), and CP 2/3 (DeviceNet^TM1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNet^TM), alsoased on CIP^TM, is defined in [13]. It neither contains the FDT specification nor modifies it.

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