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EVS-EN IEC 62812:2019
Hind 17,08 EUR
Identne IEC 62812:2019; EN IEC 62812:2019
Low resistance measurements - Methods and guidance
Resistance measurements are typically compromised by a variety of phenomena, for example serial resistance in the measurement path, self-heating or non-ohmic properties. Whether the effect of such phenomena on a resistance measurement is acceptable or not depends on the magnitude of each effect in comparison to the resistance and to the required accuracy. Hence, the risk of erroneous resistance measurements increases with decreasing resistance and with a tightening of the permissible tolerance. This document specifies methods of measurement and associated test conditions that eliminate or reduce the influence of adverse phenomena in order to improve the attainable accuracy of low-resistance measurements. The methods described in this document are applicable for the individual measurements of the resistance of individual resistors, and also for resistance measurements as part of a test sequence. They are applied if prescribed by a relevant component specification, or if agreed between a customer and a manufacturer.

EVS-EN IEC 61188-6-4:2019
Hind 16,10 EUR
Identne IEC 61188-6-4:2019; EN IEC 61188-6-4:2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
This part of IEC 61188 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

EVS-EN IEC 62884-4:2019
Hind 11,67 EUR
Identne IEC 62884-4:2019; EN IEC 62884-4:2019
Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 4 : Short-term frequency stability test methods
This part of IEC 62884 describes the methods for the measurement and evaluation of the short-term frequency stability tests of piezoelectric, dielectric and electrostatic oscillators. Its purpose is to unify the test and evaluation methods for short-term frequency stability.

EVS-EN IEC 60512-11-1:2019
Hind 8,72 EUR
Identne IEC 60512-11-1:2019; EN IEC 60512-11-1:2019
Connectors for electrical and electronic equipment - Tests and measurements - Part 11-1: Climatic tests - Test 11a - Climatic sequence
This part of IEC 60512, when required by the detail (product) specification, is used for testing connectors within the scope of IEC technical committee 48. This test may also be used for similar devices (i.e. when the degradation mechanisms are the same) when specified in a detail (product) specification. The object of this test is to define a standard test method to assess the ability of connectors to function in a specified manner, in a specified environment which might be encountered during normal use, including storage. This document provides a standard composite test method for determining the suitability of connectors when subjected to environmental conditions consisting of a sequence of temperature, humidity and, where required, low air pressure environmental stresses. The order of application of the stresses and the conditions for the change from one step to the next have been chosen to accelerate, amplify and allow potential interactions of degradation mechanisms of the same type as those observed under natural climatic conditions. In this composite test, connector specimens are exposed to environmental tests in a standard order and categorized according to their climatic category as assigned by the detail (product) specification, except that the third group of digits is used as an indication of the number of cycles in step 5 of the damp heat cyclic test according to IEC 60512-11-12. Where any modification is necessary, the relevant connector detail (product) specification provides the necessary information for each step in the method. This test is frequently specified to follow other tests involving mechanical stress, for example tests for robustness of terminations, solderability, shock and vibration, as a means of determining whether the sealing of the specimen has been damaged.

IEC TS 61994-5:2019
Hind 17,80 EUR
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection - Glossary - Part 5: Piezoelectric sensors
IEC TS 61994-5:2019(E) gives the terms and definition for sensors representing the state of the art, which are intended for manufacturing piezoelectric elements, cells and the modules.

IEC 60749-20-1:2019 RLV
Hind 277,60 EUR
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 60749-20-1:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is not an official document, it is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition.

IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions; - addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.

IEC 60747-16-6:2019
Hind 124,57 EUR
Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers
IEC 6074716-6:2019 specifies the terminology, essential ratings and characteristics, and measuring methods of microwave integrated circuit frequency multipliers.

IEC TR 61189-5-506:2019
Hind 124,57 EUR
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

IEC 60749-20-1:2019
Hind 213,54 EUR
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions; - addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.

Asendab IEC 60749-20-1:2009

Asendatud või tühistatud standardid


EVS-EN 60068-2-82:2007
Identne IEC 60068-2-82:2007; EN 60068-2-82:2007
Environmental testing -- Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components
This part of IEC 60068 specifies whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish. However, the standard does not specify tests for whiskers that may grow as a result of external mechanical stress. This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria. Where tests described in this standard are considered for other components, e.g. Mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable.
Keel: Inglise

EVS-EN 60512-11-1:2002
Identne IEC 60512-11-1:1995; EN 60512-11-1:1999
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests - Section 1: Test 11a: Climatic sequence
This section of IEC 512-11 defines a standard test method to assess the ability of a component to function in a specified manner, in a specified environment which might be encountered during normal use, including storage.
Keel: Inglise

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prEN IEC 61189-5-504:2019
Identne IEC 61189-5-504:201X; prEN IEC 61189-5-504:2019
Tähtaeg 16.09.2019
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Pocess ionic contamination testing (PICT)
This part of IEC 61189-5 is a test method designed to determine the proportion of soluble ionic residues present upon a circuit board, electronic component or assembly that are within acceptable limits to avoid their deleterious effects upon the intended electrical performance. The conductivity of the solution used to dissolve the ionic residues is measured to evaluate the level of ionic residues
Keel: Inglise

prEN IEC 60749-15:2019
Identne IEC 60749-15:201X; prEN IEC 60749-15:2019
Tähtaeg 16.09.2019
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body.
Keel: Inglise