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IEC 62391-1:2015
Hind 252,08 EUR
Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
IEC 62391-1:2015(E) applies to fixed electric double-layer capacitors (hereafter referred to as capacitor(s)) mainly used in d.c. circuits of electric and electronic equipment. This part of IEC 62391 establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose. This edition includes the following significant technical changes with respect to the previous edition: a) enhancement of the scope to include electric (high power) application; b) implementation of Annex Q, replacing Clause 3 in the first edition; c) in addition, minor revisions related to tables, figures and references. The contents of the corrigendum of December 2016 have been included in this copy.
Asendab IEC 62391-1:2006

EVS-EN 61975:2010/A1:2017
Hind 10,90 EUR
Identne EN 61975:2010/A1:2017; IEC 61975:2010/A1:2016
High-voltage direct current (HVDC) installations - System tests
Amendment for EN 61975:2010

EVS-EN 62228-2:2017
Hind 15,40 EUR
Identne IEC 62228-2:2016; EN 62228-2:2017
Integrated circuits - EMC evaluation of transceivers - Part 2: LIN transceivers
IEC 62228-2:2016 specifies test and measurement methods for EMC evaluation of LIN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers: - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses and - the immunity against electrostatic discharges (ESD).

IEC 62341-6-1:2017 RLV
Hind 291,29 EUR
Organic light emitting diode (OLED) displays - Part 6-1: Measuring methods of optical and electro-optical parameters
IEC 62341-6-1:2017 RLV contains the International Standard and its Redline version. The Redline version is available in English only. The Redline version provides you with a quick and easy way to compare all the changes between this standard and its previous edition. The Redline version is not an official IEC Standard, only the current version of the standard is to be considered the official document. IEC 62341-6-1:2017(E) specifies the standard measurement conditions and measuring methods for determining optical and electro-optical parameters of organic light-emitting diode (OLED) display modules and, where specified, OLED display panels. These methods are limited to flat displays measured in a dark room. This second edition cancels and replaces the first edition published in 2009. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) extends the applicability of the measuring methods to include OLED displays that have multi-primary or red, green, blue and white sub-pixels; b) adds a method to characterize how the luminance is affected by the amount of content on the screen; c) adds a method to determine the dark room colour gamut volume in the CIELAB colour space.

IEC 62435-2:2017
Hind 93,36 EUR
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
IEC 62435-2:2017 is related to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied. This part also includes guidance on test methods that may be used to assess generic deterioration mechanisms. Typically, this part is used in conjunction with IEC 62435-1:2017 for any device long-term storage whose duration may be more than 12 months for product scheduled for long duration storage.

IEC 60747-4:2007+AMD1:2017 CSV
Hind 420,13 EUR
Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
IEC 60747-4:2007+A1:2017 Provides requirements for the following categories of discrete devices: variable capacitance diodes and snap-off diodes, mixer diodes and detector diodes, avalanche diodes, gunn diodes,bipolar transistors and field-effect transistors. This second edition cancels and replaces the first edition, published in 1991, its amendments 1, 2 and 3 (1993, 1999 and 2001, respectively), and constitutes a technical revision. This consolidated version consists of the second edition (2007) and its amendment 1 (2017). Therefore, no need to order amendment in addition to this publication.

IEC 62433-2:2017
Hind 298,76 EUR
EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
IEC 62433-2:2017 specifies macro-models for an Integrated Circuit (IC) to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE macro-model can also be used for modelling an IC-die, a functional block and an Intellectual Property (IP) block. The ICEM-CE macro-model can be used to model both digital and analogue ICs. This edition includes the following significant technical changes with respect to the previous edition: Incorporation of an XML based exchange format for model representation.
Asendab IEC 62433-2:2008

IEC TS 61586:2017
Hind 158,72 EUR
Estimation of the reliability of electrical connectors
IEC TS 61586:2017 deals with the estimation of the inherent design reliability of electrical connectors through the definition and development of an appropriate accelerated testing programme. The basic intrinsic degradation mechanisms of connectors, which are those mechanisms which exist as a result of the materials and geometries chosen for the connector design, are reviewed to provide a context for the development of the desired test programme. While extrinsic degradation mechanisms may also significantly affect the performance of connectors, they vary widely by application and thus are not addressed in this document. This second edition cancels and replaces the first edition published in 1997. This edition constitutes a technical revision. The main technical changes with regard to the previous edition are as follows: A specific 'basic' testing protocol is defined which utilizes a single test group subjecting connectors to multiple stresses, Additional information is provided concerning test acceleration factors, A discussion of the limitations of providing MTTF/MTBF estimates for connectors has been added and the bibliography has been expanded.
Asendab IEC/TS 61586:1997

IEC 62433-3:2017
Hind 298,76 EUR
EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.

IEC 62341-6-1:2017
Hind 224,07 EUR
Organic light emitting diode (OLED) displays - Part 6-1: Measuring methods of optical and electro-optical parameters
IEC 62341-6-1:2017(E) specifies the standard measurement conditions and measuring methods for determining optical and electro-optical parameters of organic light-emitting diode (OLED) display modules and, where specified, OLED display panels. These methods are limited to flat displays measured in a dark room. This second edition cancels and replaces the first edition published in 2009. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: a) extends the applicability of the measuring methods to include OLED displays that have multi-primary or red, green, blue and white sub-pixels; b) adds a method to characterize how the luminance is affected by the amount of content on the screen; c) adds a method to determine the dark room colour gamut volume in the CIELAB colour space.
Asendab IEC 62341-6-1:2009

IEC 60747-4:2007/AMD1:2017
Hind 18,67 EUR
Amendment 1 - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
Amendment for IEC 60747-4:2007

IEC 61709:2017 RLV
Hind 400,52 EUR
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
IEC 61709:2017 RLV contains the International Standard and its Redline version. The Redline version is available in English only. The Redline version provides you with a quick and easy way to compare all the changes between this standard and its previous edition. The Redline version is not an official IEC Standard, only the current version of the standard is to be considered the official document. IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications.  Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components; rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004. This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319.

IEC 61709:2017
Hind 308,09 EUR
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion
IEC 61709:2017 gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment. The method presented in this document uses the concept of reference conditions which are the typical values of stresses that are observed by components in the majority of applications; Reference conditions are useful since they provide a known standard basis from which failure rates can be modified to account for differences in environment from the environments taken as reference conditions. Each user can use the reference conditions defined in this document or use their own. When failure rates stated at reference conditions are used it allows realistic reliability predictions to be made in the early design phase. The stress models described herein are generic and can be used as a basis for conversion of failure rate data given at these reference conditions to actual operating conditions when needed and this simplifies the prediction approach. Conversion of failure rate data is only possible within the specified functional limits of the components. This document also gives guidance on how a database of component failure data can be constructed to provide failure rates that can be used with the included stress models. Reference conditions for failure rate data are specified, so that data from different sources can be compared on a uniform basis. If failure rate data are given in accordance with this document then additional information on the specified conditions can be dispensed with. This document does not provide base failure rates for components – rather it provides models that allow failure rates obtained by other means to be converted from one operating condition to another operating condition. The prediction methodology described in this document assumes that the parts are being used within its useful life. The methods in this document have a general application but are specifically applied to a selection of component types as defined in Clauses 6 to 20 and I.2. This third edition cancels and replaces the second edition, published in 2011. This edition constitutes a technical revision. This third edition is a merger of IEC 61709:2011 and IEC TR 62380:2004. This edition includes the following significant technical changes with respect to the previous edition: addition of 4.5 Components choice, 4.6 Reliability growth during the deployment phase of new equipment, 4.7 How to use this document, and of Clause 19 Printed circuit boards (PCB) and Clause 20 Hybrid circuits with respect to IEC TR 62380; addition of failure modes of components in Annex A; modification of Annex B, Thermal model for semiconductors, adopted and revised from IEC TR 62380; modification of Annex D, Considerations on mission profile; modification of Annex E, Useful life models, adopted and revised from IEC TR 62380; revision of Annex F (former B.2.6.4), Physics of failure; addition of Annex G (former Annex C), Considerations for the design of a data base on failure rates, complemented with parts of IEC 60319; addition of Annex H, Potential sources of failure rate data and methods of selection; addition of Annex J, Presentation of component reliability data, based on IEC 60319.
Asendab IEC 61709:2011

IEC 60747-16-1:2001/AMD2:2017
Hind 18,67 EUR
Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
Amendment for IEC 60747-16-1:2001

IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV
Hind 326,77 EUR
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
IEC 60747-16-1:2001+A1:2007+A2:2017 provides the terminology, the essential ratings and characteristics, as well as the measuring methods for integrated circuit microwave power amplifiers. This consolidated version consists of the first edition (2001), its amendment 1 (2007) and its amendment 2 (2017). Therefore, no need to order amendment in addition to this publication.

IEC 61076-2-113:2017
Hind 186,72 EUR
Connectors for electronic equipment - Product requirements - Part 2-113: Circular connectors - Detail specification for connectors with M12 screw locking with power and signal contacts for data transmission with frequency up to 100 MHz
IEC 61076-2-113:2017 describes M12 circular connectors with two data pairs and power contacts with current ratings up to 12 A, that are typically used for data and power applications in industrial premises. These connectors consist of both fixed and free connectors either rewireable or non rewireable, with screw-locking. Male connectors have round contacts diameters of 1,50 mm, 1,00 mm and 0,60 mm. The different codings provided by this document prevent the mating of accordingly coded male or female connectors to any other similarly sized interfaces covered by other standards and the cross-mating between the different codings provided by this document. M12 is the dimension of the thread of the screw locking mechanism of these circular connectors.

IEC TS 62239-2:2017
Hind 280,09 EUR
Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
IEC TS 62239-2:2017(E) applies to the development of COTS assembly management plans for the integration and management of electronic COTS assemblies in electronic systems used in the ADHP markets where reliability is generally critical. Depending on program or product line requirements and/or the technical characteristics of the electronic COTS assemblies and in agreement with the customer, the electronic COTS assembly management plans could consider tailoring the requirements of this document. Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion.

IEC 62391-1:2015/COR1:2016
Hind 0,00 EUR
Corrigendum 1 - Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
Standardi IEC 62391-1:2015 parandus
Corrigendum for IEC 62391-1:2015


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EN 61760-4:2015/prA1:2017
Identne IEC 61760-4:2015/A1:201X; EN 61760-4:2015/prA1:2017
Tähtaeg 2.05.2017
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Amendment for EN 61760-4:2015
Keel: Inglise