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Uued standardid


EVS-EN 62433-3:2017
Hind 22,15 EUR
Identne IEC 62433-3:2017; EN 62433-3:2017
EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.

EVS-EN 60068-2-69:2017
Hind 18,00 EUR
Identne IEC 60068-2-69:2017; EN 60068-2-69:2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb). This edition includes the following significant technical changes with respect to the previous edition: - integration of IEC 60068-2-54; - inclusion of tests of printed boards; - inclusion of new component types, and updating test parameters for the whole component list; - inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.

EVS-EN 61076-2-113:2017
Hind 15,40 EUR
Identne IEC 61076-2-113:2017; EN 61076-2-113:2017
Connectors for electronic equipment - Product requirements - Part 2-113: Circular connectors - Detail specification for connectors with M12 screw locking with power and signal contacts for data transmission with frequency up to 100 MHz
IEC 61076-2-113:2017 describes M12 circular connectors with two data pairs and power contacts with current ratings up to 12 A, that are typically used for data and power applications in industrial premises. These connectors consist of both fixed and free connectors either rewireable or non rewireable, with screw-locking. Male connectors have round contacts diameters of 1,50 mm, 1,00 mm and 0,60 mm. The different codings provided by this document prevent the mating of accordingly coded male or female connectors to any other similarly sized interfaces covered by other standards and the cross-mating between the different codings provided by this document. M12 is the dimension of the thread of the screw locking mechanism of these circular connectors. Key words: Connectors, Circular Connectors, M12.

IEC 62908-12-10:2017
Hind 186,72 EUR
Touch and interactive displays - Part 12-10: Measurement methods of touch displays - Touch and electrical performance
IEC 62908-12-10:2017(E) specifies the standard measuring conditions and methods for determining touch performance of a touch sensor module. This document is applicable to touch sensor modules, where the structural relationship between touch sensor, touch controller, touch sensor module, display panel, touch display panel, and touch display module is defined in IEC 62908-1-2.

IEC 62884-1:2017
Hind 280,09 EUR
Measurement techniques of piezoelectric, dieletric and electrostatic oscillators - Part 1: Basic methods for the measurement
IEC 62884-1:2017(E) specifies the measurement techniques for piezoelectric, dielectric and electrostatic oscillators, including Dielectric Resonator Oscillators (DROs) and oscillators using FBAR (hereinafter referred to as "Oscillator")

IEC 61191-3:2017
Hind 93,36 EUR
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.


Asendab IEC 61191-3:1998

CLC/TS 50625-4:2017
Hind 10,19 EUR
Collection, logistics & treatment requirements for WEEE - Part 4: Specification for the collection and logistics associated with WEEE
This Technical Specification applies to the following operations: collection, handling, sorting, storage, preparation for transport and transport of WEEE. It is applicable to all WEEE prior to arriving at the treatment facility or arriving at a preparation for re-use facility. This Technical Specification addresses all operators that perform collection and logistics operations. This technical specification does not cover treatment of WEEE. In case of treatment activities undertaken at collection or logistics facilities the Standard EN 50625-1 applies.

Asendatud või tühistatud standardid


EVS-EN 60068-2-69:2007
Identne IEC 60068-2-69:2007; EN 60068-2-69:2007
Environmental testing -- Part 2: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Keel: Inglise

EVS-EN 60068-2-54:2008
Identne IEC 60068-2-54:2006; EN 60068-2-54:2006
Environmental testing -- Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Keel: Inglise

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prEN 62604-2:2017
Identne IEC 62604-2:201X; prEN 62604-2:2017
Tähtaeg 16.08.2017
Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) duplexers of assessed quality - Part 2: Guidelines for the use
No scope available
Keel: Inglise

prEN 62435-4:2017
Identne IEC 62435-4:201X; prEN 62435-4:2017
Tähtaeg 16.08.2017
Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
This part of the IEC 62435 series specifies long-term-storage, the methods and recommended conditions for long-term storage of electronic components including logistics, controls and security related to the storage facility. Long-term storage refers to a duration that may be more than 12 months for product scheduled for long duration storage. Philosophy, good working practice, and general means to facilitate the successful long-term-storage of electronic components are also addressed.
Keel: Inglise

prEN 63041-1:2017
Identne IEC 63041-1:201X; prEN 63041-1:2017
Tähtaeg 16.08.2017
Piezoelectric Sensors - Part 1: Generic Specifications
This International Standard applies to piezoelectric sensors of resonator, delay-line and non acoustic types, which are used in physical and engineering sciences, chemistry and biochemistry, medical and environmental sciences, etc. The purpose of this standard is to specify the terms and definitions for the piezoelectric sensors, and to make sure from a technological perspective that users understand the state of-art piezoelectric sensors and how to use them correctly.
Keel: Inglise

prEN 63041-2:2017
Identne IEC 63041-2:201X; prEN 63041-2:2017
Tähtaeg 16.08.2017
Piezoelectric Sensors - Part 2: Chemical and Biochemical Sensors
This international standard is applicable to piezoelectric chemical sensor mainly used in the field of biological, medical, gas and environmental sciences. The standard provides users with technical guidelines of biochemical sensors as well as basic knowledge of common chemical sensors.
Keel: Inglise