Tagasi peagrupi juurde
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Connectors for electronic equipment - Part 7-82: Detail specification for 8-way, 12 contacts, shielded, free and fixed connectors, for data transmission with frequencies up to 2 000 MHz
IEC 60603-7-82:2016 covers 8-way, 12 contacts, shielded, free and fixed connectors, references dimensional, mechanical, electrical and environmental characteristics and tests in IEC 60603-7-7, and specifies electrical transmission requirements, including power sum alien (exogenous) crosstalk, for frequencies up to 2 000 MHz. These connectors are typically used as "category 8.2" connectors in "class II" cabling systems specified in ISO/IEC TR 11801-9901 and specified in ISO/IEC 11801-1. These connectors are intermateable and interoperable with other IEC 60603-7 series connectors, i.e. as defined in IEC 60603-7-7 and IEC 60603-7-1. These connectors are backward compatible with other IEC 60603-7 series connectors.
Key words: Connectors, 8-way. Shielded Free and Fixed, Data Transmission
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Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods
IEC 62276:2012 applies to the manufacture of synthetic quartz, lithium niobate (LN), lithium tantalate (LT), lithium tetraborate (LBO), and lanthanum gallium silicate (LGS) single crystal wafers intended for use as substrates in the manufacture of surface acoustic wave (SAW) filters and resonators. This edition includes the following significant technical changes with respect to the previous edition: - terms and definitions are rearranged in accordance with the alphabetical order; - 'reduced LN' is appended to terms and definitions; - 'reduced LT' is appended to terms and definitions; - reduction process is appended to terms and definitions.
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Connectors for electronic equipment - product requirements - Part 3-120: Rectangular connectors - Detail specification for rewirable power connectors with snap locking for rated voltage of 250 V d.c. and rated current of 30 A (IEC 61076-3-120:2016)
IEC 61076-3-120:2016 describes a 2 pole 30 A rectangular power connector with snap locking (hereinafter shortly referred to as connector), including overall dimensions, interface dimensions, technical characteristics, performance requirements and test methods. The products covered by this detail specification are connectors without breaking capacity according to IEC 61984:2008 which are mainly for use in DC power distribution equipment in the telecommunications field, such as in outdoor telecom modules, distributed frames, etc.
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Identne EN 140402:2015/A1:2016
Blank Detail Specification: Fixed low power wirewound surface mount (SMD) resistors
Specific Amendment to the EN 140402 to add an Annex D which, owing to the nature of a Blank Detail Specification, consists of the blank template for the Annex with respective editorial comments.
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Amendment 2 - International electrotechnical vocabulary - Part 702: Oscillations, signals and related devices
Amendment for IEC 60050-702:1992
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Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation
IEC 61587-1:2016: specifies environmental requirements, test set-up, as well as safety aspects for empty enclosures, i.e., cabinets, racks, subracks, chassis with an integrated subrack, and associated plug-in units under indoor condition use and transportation. The purpose of this standard is to establish defined levels of physical performance in order to meet certain requirements of storage, transport and final location conditions. It applies in whole or part only to the mechanical structures of cabinets, racks, subracks, chassis with an integrated subrack, and associated plug-in units, but it does not apply to electronic equipment. This fourth edition cancels and replaces the third edition published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: total overhaul of Clause 7 "Mechanical tests" and compatibility with IEC 61587-5.
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Touch and interactive displays - Part 13-10: Reliability test methods of touch displays - Environmental durability test methods
IEC 62908-13-10:2016(E) specifies the methods for testing the environmental durability of touch display modules, touch sensor modules and test pattern cells, and can be used for devices at the production level, the prototype level or the trial model level when they are exposed to environmental stress. This document is applicable for touch displays that use capacitive or resistive detection sensors. It may also be applicable to other types of sensors as well as to touch display modules with both flat and flexible displays.
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Measurement of quartz crystal unit parameters - Part 8 : Test fixture for surface mounted quartz crystal units
IEC 60444-8:2016(E) describes test fixtures suitable for leadless surface mounted quartz crystal units in enclosures as defined in IEC 61837 (all parts). These fixtures allow the measurement of (series) resonance frequency, (series) resonance resistance, and equivalent electrical circuit parameters L1, C1 and C0 using the measurement techniques specified in IEC 60444-5 and for the determination of load resonance frequency and load resonance resistance according to IEC TR 60444-4 and IEC 60444-11.
Two test fixtures are described in this document:
1) A fixture using the p-network circuit with electrical values as described in IEC 60444-1 for measurements in transmission mode up to 500 MHz. This fixture includes optional means to add physical load capacitors for the measurement of load resonance parameters up to 30 MHz in accordance with IEC 60444-4. The range of load capacitance is 10 F or more. Calibration of the measurement system and CL adapter board is explained hereinafter.
2) A fixture based on the reflection method, suitable for a frequency range up to 1 200 MHz. No provisions for adding a physical load capacitance are anticipated. Load resonance parameters can be measured by using the method of IEC 60444-11.
This edition includes the following significant technical changes with respect to the previous edition:
a) modification of Clause 1;
b) modification of 5.2;
c) modification of 5.3;
d) modification of 5.4;
e) 6.3 Calibration of the reflection measurement system.
IEC TR 62899-250:2016
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Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
IEC TR 62899-250:2016(E), which is a Technical Report (TR), explores a new technological field to establish standardization activities in TC 119 (Printed electronics) in particular, and to contribute to the development and market expansion of wearable smart device (WSD) technology.
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Amendment 1 - International electrotechnical vocabulary - Part 561: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
Amendment for IEC 60050-561:2014
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Corrigendum 1 - Marking codes for resistors and capacitors
Standardi IEC 60062:2016 parandus
Corrigendum for IEC 60062:2016
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Corrigendum 1 - Fixed capacitors for use in electronic equipment - Part 24: Sectional specification - Fixed tantalum electrolytic surface mount capacitors with conductive polymer solid electrolyte
Standardi IEC 60384-24:2015 parandus
Corrigendum for IEC 60384-24:2015
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Marking codes for resistors and capacitors
Corrigendum for EN 60062:2016
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Identne IEC 62391-1:2015/COR1:2016; EN 62391-1:2016/AC:2016-12
Fixed electric double-layer capacitors for use in electric and electronic equipment - Part 1: Generic specification
Corrigendum for EN 62391-1:2016
Asendatud või tühistatud standardid
Identne IEC 62276:2012; EN 62276:2013
Single crystal wafers for surface acoustic wave (SAW) devices applications - Specifications and measuring method (IEC 62276:2012)
This International Standard applies to the manufacture of synthetic quartz, lithium niobate (LN), lithium tantalate (LT), lithium tetraborate (LBO), and lanthanum gallium silicate (LGS) single crystal wafers intended for use as substrates in the manufacture of surface acoustic wave (SAW) filters and resonators.
prEN ISO 11553-1
Safety of machinery - Laser processing machines - Part 1: General safety requirements (ISO/DIS 11553-1:2016)
No scope available
prEN ISO 11553-2
Safety of machinery - Laser processing machines - Part 2: Safety requirements for hand-held laser processing devices (ISO/DIS 11553-2:2016)
No scope available
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
NOTE For preparation of outline drawings of surface mounted discrete devices with lead count higher or equal to 8, IEC 60191-6 should be referred to as well.
The primary object of these drawings is to indicate the space which should be allowed for devices in an equipment, together with other dimensional characteristics required to ensure mechanical interchangeability.
It should be noted that complete interchangeability involves other considerations such as the electrical and thermal characteristics of the semiconductor devices concerned.
The international standardization represented by these drawings therefore encourages the manufacturers of devices to comply with the tolerances shown on the drawings in order to extend their range of customers internationally. It also gives equipment designers an assurance of mechanical interchangeability between the devices obtained from suppliers in different countries, provided they allow the space in their equipment that is indicated by the drawings and take note of the more precise information on bases, studs, etc.
NOTE Additional details of reference letter symbols used in this standard are given in Annex A.
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
This part of IEC 61191 prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other
related technologies (i.e. surface mount, chip mounting, terminal mounting).
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
This part of IEC 61191 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).