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CLC/TR 62258-3:2007

Semiconductor die products -- Part 3: Recommendations for good practice in handling, packing and storage

General information

Withdrawn from 16.10.2023
Base Documents
IEC/TR 62258-3:2005; CLC/TR 62258-3:2007
Directives or regulations
None

Standard history

Status
Date
Type
Name
05.04.2007
Main
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached connection structures, and  – minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products.

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