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EVS-EN 62137-3:2012

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

General information
Valid from 03.02.2012
Base Documents
IEC 62137-3:2011; EN 62137-3:2012
Directives or regulations
None
Standard history
Status
Date
Type
Name
03.02.2012
Main
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.
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Standard monitoring