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EVS-EN 62258-6:2006

Semiconductor die products -- Part 6: Requirements for information concerning thermal simulation

General information
Valid from 06.11.2006
Base Documents
IEC 62258-6:2006; EN 62258-6:2006
Directives or regulations
None
Standard history
Status
Date
Type
Name
06.11.2006
Main
This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: • wafers; • singulated bare die; • die and wafers with attached connection structures; • minimally or partially encapsulated die and wafers.
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