Back

EVS-EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

General information
Valid from 01.11.2021
Base Documents
IEC 61189-2-807:2021; EN IEC 61189-2-807:2021
Directives or regulations
None
Standard history
Status
Date
Type
Name
01.11.2021
Main
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
*
*
*
PDF
8.86 € incl tax
Paper
8.86 € incl tax
Price: 2.40 € incl tax
Standard monitoring