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EVS-EN IEC 61760-3:2021

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

General information
Valid from 01.04.2021
Base Documents
IEC 61760-3:2021; EN IEC 61760-3:2021
Directives or regulations
None
Standard history
Status
Date
Type
Name
01.04.2021
Main
07.06.2010
Main
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology. The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended. Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.
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