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IEC 60749-25:2003

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

General information

Valid from 11.07.2003
Directives or regulations
None

Standard history

Status
Date
Type
Name
11.07.2003
Main
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

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