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IEC 60749-30:2020

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

General information
Valid from 17.08.2020
Directives or regulations
None
Standard history
Status
Date
Type
Name
17.08.2020
Main
10.08.2011
Main
25.05.2011
Amendment
20.01.2005
Main
IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3; - expansion of 6.7 on solder reflow; - inclusion of explanatory notes and clarifications.
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