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IEC 61188-5-1:2002

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

General information
Withdrawn from 24.02.2021
Directives or regulations
None
Standard history
Status
Date
Type
Name
23.02.2021
Main
12.07.2002
Main
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
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