Back

IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

General information
Valid from 23.02.2021
Directives or regulations
None
Standard history
Status
Date
Type
Name
23.02.2021
Main
12.07.2002
Main
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
*
*
*
PDF
227.77 € incl tax
Paper
227.77 € incl tax
Standard monitoring