Back

IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

General information
Valid from 16.07.2021
Directives or regulations
None
Standard history
Status
Date
Type
Name
16.07.2021
Main
24.04.2007
Main
IEC 61760-2:2021 specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.) The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". Cross-references for references from this edition 3 to the previous edition 2 of this document are listed in Annex X of this document.
*
*
*
PDF
77.77 € incl tax
PDF redline
108.88 € incl tax
Paper
77.77 € incl tax
Standard monitoring