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IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

General information
Valid from 14.10.2019
Directives or regulations
None
Standard history
Status
Date
Type
Name
14.10.2019
Main
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
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