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IEC 62878-1:2019

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

General information
Valid from 14.10.2019
ICS Groups
31.180 Printed circuits and boards 31.190 Electronic component assemblies
Directives or regulations
None

Standard history

Status
Date
Type
Name
14.10.2019
Main
IEC 62878-1:2019
IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
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EVS Estonian standard
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HD CENELEC’s harmonisation document
   
EVS-EN European standard implemented in Estonia
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EVS-ISO International standard implemented in Estonia
   
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et the standard is in Estonian only
en the standard is in English only
et-en the standard is in Parallel text Estonian-English

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