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IEC 63055:2023

Format for LSI-Package-Board Interoperable design

General information

Valid from 11.10.2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
11.10.2023
Main
08.11.2016
Main
IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.

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