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IEC TR 63378-1:2021

Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

General information
Valid from 14.12.2021
Directives or regulations
None
Standard history
Status
Date
Type
Name
14.12.2021
Main
IEC TR 63378-1:2021(E) specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
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