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ISO 9453:2014

Soft solder alloys -- Chemical compositions and forms

General information
Withdrawn from 24.09.2020
Directives or regulations
None

Standard history

Status
Date
Type
Name
24.09.2020
Main
18.08.2014
Main
Main
ISO 9453:2006
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
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