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ISO 9453:2020

Soft solder alloys -- Chemical compositions and forms

General information
Valid from 24.09.2020
Directives or regulations
None
Standard history
Status
Date
Type
Name
24.09.2020
Main
18.08.2014
Main
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An indication of the forms generally available is also included.
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