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ISO 9455-17:2024

Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

General information
Valid from 10.01.2024
Directives or regulations
None

Standard history

Status
Date
Type
Name
10.01.2024
Main
23.11.2004
Main
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
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