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prEN IEC 61189-2-720:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

General information
Draft
Base Documents
91/1832/CDV; prEN IEC 61189-2-720:2023
Directives or regulations
None

Standard history

Status
Date
Type
Name
This document provides a method to evaluate specific characteristics of printed boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
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