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prEN IEC 61189-2-807:2021

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition Temperature (Td) using TGA

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Draft
Base Documents
IEC 61189-2-807:202X; prEN IEC 61189-2-807:2021
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None
Standard history
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Date
Type
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This International Standard specifies a test method to determine the decomposition temperature(Td) of base laminate materials using thermogravimetric analysis (TGA).
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