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prEN IEC 61189-3-302:2024

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

General information

Draft
Base Documents
91/1973/CDV; prEN IEC 61189-3-302:2024
Directives or regulations
None
You can view draft standards in the Commenting portal🡭.

Standard history

Status
Date
Type
Name
This document describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT) .
This document is applicable to non-destructive testing of metallized holes.

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