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EVS-EN 61192-2:2003

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

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Kehtetu alates 02.05.2019
Alusdokumendid
IEC 61192-2:2003; EN 61192-2:2003
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Standardi ajalugu
Staatus
Kuupäev
Tüüp
Nimetus
01.09.2003
Põhitekst
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting
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