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EVS-EN IEC 60286-3:2019

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Üldinfo
Kehtetu alates 30.12.2022
Alusdokumendid
IEC 60286-3:2019; EN IEC 60286-3:2019
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Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
30.12.2022
Põhitekst
15.03.2019
Põhitekst
09.12.2013
Parandus
EVS-EN 60286-3:2013/AC:2013
09.09.2013
Põhitekst
EVS-EN 60286-3:2013
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
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