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EVS-EN IEC 62148-21:2021

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Üldinfo
Kehtiv alates 15.06.2021
Alusdokumendid
IEC 62148-21:2021; EN IEC 62148-21:2021
Tegevusala (ICS grupid)
33.180.20 Kiudoptika liitmikud
Direktiivid või määrused
puuduvad
Standardi ajalugu
Staatus
Kuupäev
Tüüp
Nimetus
15.06.2021
Põhitekst
15.05.2019
Põhitekst
IEC 62148-21: 2021 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages. This second edition cancels and replaces the first edition published in 2019. This edition constitutes a technical revision. This edition includes the following significant technical change with respect to the previous edition: specification of an electric guard band area around the optical terminal area, so as to allow applications with electric signals at higher symbol rates (e.g. 50 Gbaud and 100 Gbaud).
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