Tagasi

IEC 60749-15:2010

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Üldinfo
Kehtetu alates 14.07.2020
Direktiivid või määrused
puuduvad
Standardi ajalugu
Staatus
Kuupäev
Tüüp
Nimetus
14.07.2020
Põhitekst
28.10.2010
Põhitekst
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.
*
*
*
PDF
22,09 € koos KM-ga
Paber
22,09 € koos KM-ga
Standardi monitooring