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prEN IEC 60068-2-83:2024

Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

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Kavand
Alusdokumendid
91/1968/CDV; prEN IEC 60068-2-83:2024
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Staatus
Kuupäev
Tüüp
Nimetus
02.11.2011
Põhitekst
This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste.
Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.

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