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prEN IEC 60749-37:2020

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

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Alusdokumendid
IEC 60749-37:202X; prEN IEC 60749-37:2020
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Tüüp
Nimetus
09.06.2008
Põhitekst
This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. The purpose of this standard is to prescribe a standardized test method and reporting procedure. This is not a component qualification test and is not meant to replace any system level drop test that may be needed to qualify a specific handheld electronic product. The standard is not meant to cover the drop test required to simulate shipping and handling related shock of electronic components or PCB assemblies. These requirements are already addressed in test methods such as IEC 60749-10. The method is applicable to both area array and perimeter-leaded surface mounted packages. This test method uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The test method described in IEC 60749-40 uses strain gauge to measure the strain and strain rate of a board in the vicinity of a component. The detailed specification states which test method is to be used.
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