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EVS-EN 60068-2-83:2011

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance methodusing solder paste

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Kehtiv alates 02.11.2011
Alusdokumendid
IEC 60068-2-83:2011; EN 60068-2-83:2011
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02.11.2011
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This part of IEC 60068 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass – fail purposes.
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EVS-EN 60068-2-58:2015

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Uusim versioon Kehtiv alates 08.06.2015
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EVS-EN 60068-2-60:2015

Environmental testing - Part 2-60: Tests - Test Ke: Flowing mixed gas corrosion test
Uusim versioon Kehtiv alates 05.01.2016
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EVS-EN 60068-2-39:2016

Environmental testing - Part 2-39: Tests - Tests and guidance: Combined temperature or temperature and humidity with low air pressure tests
Uusim versioon Kehtiv alates 03.02.2016
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EVS-EN 60068-2-75:2014

Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests
Uusim versioon Kehtiv alates 09.12.2014