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EVS-EN 60286-3:2013

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013)

Üldinfo
Kehtetu alates 15.03.2019
Alusdokumendid
IEC 60286-3:2013; EN 60286-3:2013
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Standardi ajalugu

Staatus
Kuupäev
Tüüp
Nimetus
15.03.2019
Põhitekst
09.12.2013
Parandus
EVS-EN 60286-3:2013/AC:2013
09.09.2013
Põhitekst
EVS-EN 60286-3:2013
08.10.2009
Põhitekst
EVS-EN 60286-3-1:2009
08.10.2009
Põhitekst
EVS-EN 60286-3-2:2009
Põhitekst
EVS-EN 60286-3:2007
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
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