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31 Electronics
New standards
IEC 60747-5-18:2026
Semiconductor devices - Part 5-18: Optoelectronic devices - Light emitting diodes - Test method of the macro photoluminescence for epitaxial wafers of micro light emitting diodes
Scope: IEC 60747-5-18:2026 specifies the measuring methods of macro photoluminescence (PL) for red, green, and blue epitaxial wafers of micro light emitting diodes (LEDs) prior to chip fabrication processes. Wafer sizes being considered are 4 in, 6 in, and 8 in in diameter.
Base documents:
IEC 61760-1:2026
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Scope: IEC 61760-1:2026 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
This edition includes the following significant technical changes with respect to the previous edition:
a) added new subclause 4.2 - Classification of electronic assemblies;
b) added new subclause 4.4.8 - Creepage and clearance distances - Insulation coordination;
c) added new subclause 4.9 - Thermal and electrical performance;
d) updated Clause 6 - Soldering: now including requirements related to application of low temperature solders;
e) added new subclause 6.2.2 - Commonly used solder alloys;
f) updated subclause 6.3.6 - Resistance to vacuum during soldering;
g) updated subclause 6.3.7 - Resistance to cleaning media and processes - now includes the tests in IEC 60068-2-88, Tests - Test XD: Resistance of components and assemblies to liquid cleaning media;
h) added new subclause 6.3.9 - Rework of soldered components;
i) added new Annex B - Sustainability.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
This edition includes the following significant technical changes with respect to the previous edition:
a) added new subclause 4.2 - Classification of electronic assemblies;
b) added new subclause 4.4.8 - Creepage and clearance distances - Insulation coordination;
c) added new subclause 4.9 - Thermal and electrical performance;
d) updated Clause 6 - Soldering: now including requirements related to application of low temperature solders;
e) added new subclause 6.2.2 - Commonly used solder alloys;
f) updated subclause 6.3.6 - Resistance to vacuum during soldering;
g) updated subclause 6.3.7 - Resistance to cleaning media and processes - now includes the tests in IEC 60068-2-88, Tests - Test XD: Resistance of components and assemblies to liquid cleaning media;
h) added new subclause 6.3.9 - Rework of soldered components;
i) added new Annex B - Sustainability.
Base documents:
Replaces: IEC 61760-1:2020
IEC 61760-1:2026 CMV
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Scope: IEC 61760-1:2026 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC 61760-1:2026 edition 4.0 and the previous IEC 61760-1:2020 edition 3.0. Furthermore, comments from IEC TC 91 experts are provided to explain the reasons of the most relevant changes, or to clarify any part of the content.
IEC 61760-1:2026 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
This edition includes the following significant technical changes with respect to the previous edition:
a) added new subclause 4.2 - Classification of electronic assemblies;
b) added new subclause 4.4.8 - Creepage and clearance distances - Insulation coordination;
c) added new subclause 4.9 - Thermal and electrical performance;
d) updated Clause 6 - Soldering: now including requirements related to application of low temperature solders;
e) added new subclause 6.2.2 - Commonly used solder alloys;
f) updated subclause 6.3.6 - Resistance to vacuum during soldering;
g) updated subclause 6.3.7 - Resistance to cleaning media and processes - now includes the tests in IEC 60068-2-88, Tests - Test XD: Resistance of components and assemblies to liquid cleaning media;
h) added new subclause 6.3.9 - Rework of soldered components;
i) added new Annex B - Sustainability.
IEC 61760-1:2026 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
This edition includes the following significant technical changes with respect to the previous edition:
a) added new subclause 4.2 - Classification of electronic assemblies;
b) added new subclause 4.4.8 - Creepage and clearance distances - Insulation coordination;
c) added new subclause 4.9 - Thermal and electrical performance;
d) updated Clause 6 - Soldering: now including requirements related to application of low temperature solders;
e) added new subclause 6.2.2 - Commonly used solder alloys;
f) updated subclause 6.3.6 - Resistance to vacuum during soldering;
g) updated subclause 6.3.7 - Resistance to cleaning media and processes - now includes the tests in IEC 60068-2-88, Tests - Test XD: Resistance of components and assemblies to liquid cleaning media;
h) added new subclause 6.3.9 - Rework of soldered components;
i) added new Annex B - Sustainability.
Base documents:
IEC PAS 63702:2026
Classification of additive manufacturing and 3D-printing processes for electronics
Scope: IEC PAS 63702:2026 describes the classification of additive manufacturing and 3D-printing processes for electronics.
Base documents:
IEC 61837-2:2018/AMD2:2026
Amendment 2 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
Scope:
Base documents:
IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
Scope: IEC 61837-2:2018+AMD1:2020+AMD2:2026 CSV deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016. This edition includes the following significant technical changes with respect to the previous edition:
- revision of the figures to match the notation of the drawings of IEC 61240:2016;
- addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
- revision of the figures to match the notation of the drawings of IEC 61240:2016;
- addition of 7 enclosures as follows: DCC-6/5032A, DCC-6/3225A, DCC-4/3215C, DCC-6/2016A, DCC-2/2012C, DCC-2/1610C, DCC-4/1210C.
As a result, this third edition contains a total of 45 enclosure types, which are listed in Table 1.
Base documents:
IEC 62715-6-42:2026
Flexible displays - Part 6-42: Mechanical test methods - Flattening force measurement methods for rollable display devices
Scope: IEC 62715-6-42:2026 specifies the standard measurement conditions and methods for determining the flattening force of rollable display devices when stretched to a flat state. This document applies to display panels and modules that are rollable along a single axis or a double axis.
Base documents:
Replaced standards
IEC 61760-1:2020
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Scope: IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.
This edition includes the following significant technical changes with respect to the previous edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses.
This edition includes the following significant technical changes with respect to the previous edition:
a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.
Base documents:
Replaced: IEC 61760-1:2026
Drafts
EN IEC 61051-2:2021/prA1:2026
Amendment 1 - Varistors for use in electronic equipment - Part 2: Sectional specification for surge suppression varistors
Scope: Amendment to EN IEC 61051-2:2021
Base documents: 40/3311/CDV; EN IEC 61051-2:2021/prA1:2026