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EVS-EN IEC 61760-1:2026
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Scope: This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides
component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that are included in any SMD component’s general, sectional or detail specification. In addition, this document provides
component users and manufacturers with a reference set of typical process conditions used in surface mounting technology.
Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board, including solderless interconnection technology. Cases for which this is appropriate are indicated in the relevant subclauses.
NOTE Solderless interconnection technology refers to a mounting method which is not part of the surface-mounting process and the components do not undergo a soldering operation. Such components are included in this document because the mounting of components for solderless interconnection commonly occurs after the mounting of SMDs.
Base documents: IEC 61760-1:2026; EN IEC 61760-1:2026
Replaces: EVS-EN IEC 61760-1:2020
EVS-EN IEC 60115-4-10:2026
Fixed resistors for use in electronic equipment - Part 4-10: Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
Scope: COMMENT The text of this clause may repeat information already given in some fields of the above title block.
Essential information on the special type of components covered by the drafted detail specification may be added,
preferably at the place marked with "…".
This detail specification specifies the characteristics and ratings of fixed power resistors with axial leads for through hole assembly (THT) on circuit boards …
...
The resistors covered herein are classified to level G, as defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals.
This detail specification is based upon the blank detail specification IEC 60115-4-10:2023.
This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures specified by IEC 60115-1:2020, Annex Q.
Essential information on the special type of components covered by the drafted detail specification may be added,
preferably at the place marked with "…".
This detail specification specifies the characteristics and ratings of fixed power resistors with axial leads for through hole assembly (THT) on circuit boards …
...
The resistors covered herein are classified to level G, as defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals.
This detail specification is based upon the blank detail specification IEC 60115-4-10:2023.
This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures specified by IEC 60115-1:2020, Annex Q.
Base documents: IEC 60115-4-10:2023; EN IEC 60115-4-10:2026
Replaces: EVS-EN 140201:2002
EVS-EN IEC 60115-4-10:2026/A11:2026
Fixed resistors for use in electronic equipment - Part 4-10: Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G
Scope: This part of IEC 60115 is applicable to fixed power resistors with axial leads for through hole assembly (THT) on circuit boards for use in electronic equipment.
The document is applicable to the drafting of detail specifications for fixed low-power film resistors with leads classified to level G, which is defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals.
This detail specification is based upon the blank detail specification IEC 60115-4-10:202X. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.
The document is applicable to the drafting of detail specifications for fixed low-power film resistors with leads classified to level G, which is defined in IEC 60115-1:2020, 3.4 for general electronic equipment, typically operated under benign or moderate environmental conditions, where the major requirement is function. Examples for level G include consumer products and telecommunication user terminals.
This detail specification is based upon the blank detail specification IEC 60115-4-10:202X. This detail specification establishes test schedules and performance requirements permitting the quality assessment of the resistors covered herein according to the quality assessment procedures prescribed by IEC 60115-1:2020, Annex Q.
Base documents: EN IEC 60115-4-10:2026/A11:2026
EVS-EN IEC 61837-2:2018/A2:2026
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
Scope: Amendment to EN IEC 61837-2:2018
Base documents: IEC 61837-2:2018/AMD2:2026; EN IEC 61837-2:2018/A2:2026
ISO 11551:2026
Optics and photonics — Lasers and laser-related equipment — Test method for absorptance of optical laser components
Scope: This document specifies procedures and techniques for obtaining comparable values for the absorptance of optical laser components.
Base documents:
Replaces: ISO 11551:2019
IEC 61076-2-117:2026
Connectors for electrical and electronic equipment - Product requirements - Part 2-117: Detail specification for shielded and unshielded, free and fixed connectors M12 to M40 for power, auxiliary and data transmission with frequencies up to 600 MHz
Scope: IEC 61076-2-117:2026 This part covers shielded and unshielded, free and fixed circular connectors without breaking capacity (COC) for power, signal and data transmission, and specifies the common dimensions, mechanical, electrical and transmission characteristics and environmental requirements as well as test specifications, respectively.
Base documents:
IEC 61076-8-110:2026
Connectors for electrical and electronic equipment - Product requirements - Part 8-110: Power connectors - Detail specification for 2P 300 A 1 000 V DC plus 2P 5 A 50 V DC shielded rectangular connectors with IP65/IP68 degree of protection when mated and locked, and IPXXB when unmated
Scope: IEC 61076-8-110:2026 This part describes free and fixed rectangular connectors, hereinafter referred to as “connector”, with:
2P power plus 2P signal contacts;
- plastic housing with locking lever and four possible codings;
- 300 A rated current, 1 000 V DC rated voltage on the power section;
- 5 A rated current, 50 V DC rated voltage on the signal section;
- individual shielding around each power contact with relevant shielding termination;
- IP65/IP68 degree of protection when mated and locked and IPXXB on both plug and receptacle parts when unmated
2P power plus 2P signal contacts;
- plastic housing with locking lever and four possible codings;
- 300 A rated current, 1 000 V DC rated voltage on the power section;
- 5 A rated current, 50 V DC rated voltage on the signal section;
- individual shielding around each power contact with relevant shielding termination;
- IP65/IP68 degree of protection when mated and locked and IPXXB on both plug and receptacle parts when unmated
Base documents:
Replaced standards
EVS-EN 140201:2002
Blank detail specification: Fixed power resistors (Assessment level S)
Scope: The numbers between square brackets on the first page correspond to the following indications which should be given.
Base documents: EN 140201:1996
Replaced: EVS-EN IEC 60115-4-10:2026
ISO 11551:2019
Optics and photonics -- Lasers and laser-related equipment -- Test method for absorptance of optical laser components (Corrected version 2020-01)
Scope: This document specifies procedures and techniques for obtaining comparable values for the absorptance of optical laser components.
Base documents:
Replaced: ISO 11551:2026
EVS-EN IEC 61760-1:2020
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Scope: IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.
Base documents: EN IEC 61760-1:2020; IEC 61760-1:2020
Replaced: EVS-EN IEC 61760-1:2026
Drafts
prEN IEC 61191-10-2:2026
Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate
Scope: This part of IEC 61191-10 describes a process used for setting the bonding parameters by measuring time-temperature profile in laser-assisted bonding (LAB) in flip-chip packaging technology.
NOTE Laser-assisted bonding can as well be used in other processes, such as LED bonding, solar-cell bonding, and hermetic sealing of MEMS components.
NOTE Laser-assisted bonding can as well be used in other processes, such as LED bonding, solar-cell bonding, and hermetic sealing of MEMS components.
Base documents: 91/2120/CDV; prEN IEC 61191-10-2:2026