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31 Electronics
New standards
EVS-EN IEC 61189-2-720:2024
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
Scope:
IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
Base documents:
IEC 61189-2-720:2024; EN IEC 61189-2-720:2024
IEC 61643-332:2024
Components for low-voltage surge protection - Part 332: Selection and application principles for metal oxide varistors (MOV)
Scope:
IEC 61643-332:2024 describes the theory of operation, principles for the selection and application of MOVs to be connected to power lines or telecommunication or signalling circuits, up to 1 000 V AC or 1 500 V DC. These SPCs are designed to protect apparatus or personnel, or both, from high transient voltages. This document applies to MOVs having two electrodes and voltage dependents elements with or without disconnectors. It does not apply to assemblies that include MOVs and their influence on the MOV's characteristics. This standard specifically discusses the zinc-oxide type of MOVs.
Base documents:
IEC 61189-2-805:2024
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
Scope:
IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid for the entire range of temperature used, and that retain sufficient rigidity over the temperature range so that so that irreversible indentation of the specimen by the sensing probe does not occur.
Base documents:
IEC 61189-2-808:2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
Scope:
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
Base documents:
Replaced standards
EVS-EN 111100:2005
Sectional Specification: Display storage tubes
Scope:
No scope available.
Base documents:
EN 111100:1991
EVS-EN 111101:2005
Blank Detail Specification: Display storage tubes
Scope:
No scope available.
Base documents:
EN 111101:1991
EVS-EN 114000:2005
Generic Specification: Photomultiplier tubes
Scope:
No scope available.
Base documents:
EN 114000:1991
EVS-EN 114001:2005
Blank Detail Specification: Photomultiplier tubes
Scope:
No scope available.
Base documents:
EN 114001:1991
EVS-EN 112000:2005
Generic Specification: Image converter and image intensifier tubes
Scope:
No scope available.
Base documents:
EN 112000:1992
EVS-EN 112001:2005
Blank Detail Specification: Image converter and image intensifier tubes
Scope:
No scope available.
Base documents:
EN 112001:1991
EVS-EN 120005:2005
Blank Detail Specification: Photodiodes, photodiode arrays (not intended for fibre optic applications)
Scope:
No scope available.
Base documents:
EN 120005:1992
EVS-EN 120002:2016
Blank Detail Specification: Infrared emitting diodes, infrared emitting diode arrays
Scope:
Blank detail specification
Base documents:
EN 120002:1992
EVS-EN 113000:2005
Generic Specification: Camera tubes
Scope:
No scope available.
Base documents:
EN 113000:1991
EVS-EN 113001:2005
Blank Detail Specification: Camera tubes
Scope:
No scope available.
Base documents:
EN 113001:1991
EVS-EN 120001:2005
Blank Detail Specification: Light emitting diodes, light emitting diode arrays, light emitting diode displays without internal logic and resistor
Scope:
No scope available.
Base documents:
EN 120001:1992
EVS-EN 120003:2005
Blank Detail Specification: Phototransistors, photodarlington transistors, phototransistor arrays
Scope:
No scope available.
Base documents:
EN 120003:1992
EVS-EN 120004:2005
Blank Detail Specification: Ambient rated photocouplers with phototransistor output
Scope:
No scope available.
Base documents:
EN 120004:1992
Drafts
prEN IEC 62031:2024
LED modules - Safety requirements
Scope:
This document specifies safety requirements for LED modules for operation at supply of a DC supply of up to 1 500 V or an AC supply up to 1 000 V. This document does not include requirements for performance characteristics of LED light sources.
NOTE 1 LED light sources as defined in IEC 60050-845:2020, 845-27-053 can take the form of an LED module or an LED lamp.
This document does not apply to:
– LED packages;
– LED light sources for automotive lighting;
– OLED light sources;
NOTE 2 Independent LED modules (see IEC 60050, 845-27-064) are considered luminaires with integral LED module(s) and are covered by the IEC 60598 series.
NOTE 3 LED modules that are an integral component of the luminaire are covered by the requirements within IEC 60598-1:XXXX, Clause 4.3.1, referencing this document as far as applicable.
NOTE 4 Where the word "LED module" is used in this document, it is understood to be "built-in LED module” as defined in IEC 60050-845:2020, 845-27-062.”
NOTE 1 LED light sources as defined in IEC 60050-845:2020, 845-27-053 can take the form of an LED module or an LED lamp.
This document does not apply to:
– LED packages;
– LED light sources for automotive lighting;
– OLED light sources;
NOTE 2 Independent LED modules (see IEC 60050, 845-27-064) are considered luminaires with integral LED module(s) and are covered by the IEC 60598 series.
NOTE 3 LED modules that are an integral component of the luminaire are covered by the requirements within IEC 60598-1:XXXX, Clause 4.3.1, referencing this document as far as applicable.
NOTE 4 Where the word "LED module" is used in this document, it is understood to be "built-in LED module” as defined in IEC 60050-845:2020, 845-27-062.”
Base documents:
34A/2390/CDV; prEN IEC 62031:2024
prEN IEC 63378-3:2024
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
Scope:
This part of IEC 63378 specifies the thermal circuit network model of discrete (TO-243, TO-252 and TO-263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.
This model is assumed to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
This model is assumed to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
Base documents:
47D/967/CDV; prEN IEC 63378-3:2024