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prEN IEC 61189-3-720:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

General information

Draft
Base Documents
prEN IEC 61189-3-720:2025; 91/2081/CDV
Directives or regulations
None
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Standard history

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prEN IEC 61189-3-720:2025
This International Standard specifies the S Parameter test method for the internal transmission circuit of a multilayer CB(Circuit Board) for high frequency up to 50 GHz. The transmission loss test method that applies the VIPPO structure to the CB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency CB. And use of back-drilling with Via In Pad Plated Over(VIPPO) structure can eliminate influence of stubs on signal transmission

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