Back

EVS-EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

General information
Valid from 01.04.2021
Base Documents
IEC 61188-6-2:2021; EN IEC 61188-6-2:2021
Directives or regulations
None
Standard history
Status
Date
Type
Name
01.04.2021
Main
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.
*
*
*
PDF
15.86 € incl tax
Paper
15.86 € incl tax
Price: 2.40 € incl tax
Standard monitoring