This part of IEC 61760 specifies the classification of moisture sensitive devicesmoisture sensitive device (3.1) into moisture sensitivity levelsmoisture sensitivity level (3.2) related to soldering heat, and provisions for packaging, labelling and handling.
This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging.
This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to
• semiconductor devices,
• devices for flow (wave) soldering.
NOTE Background of this standard and its relation to currently existing standards, e.g. IEC 60749‑20 or J-STD-020F [1]and J-STD-033 [2], are described in the INTRODUCTION.
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