Infoteenus
31.080 Pooljuhtseadised
Uued standardid
EVS-EN IEC 60749-20-1:2026
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Käsitlusala: IEC 60749-20-1:2019 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs that have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date. This edition includes the following significant technical changes with respect to the previous edition: - updates to subclauses to better align the test method with IPC/JEDEC J-STD-033C, including new sections on aqueous cleaning and dry pack precautions; - addition of two annexes on colorimetric testing of HIC (humidity indicator card) and derivation of bake tables.
Alusdokumendid: IEC 60749-20-1:2019; EN IEC 60749-20-1:2026
Asendab: EVS-EN 60749-20-1:2009
IEC 62031:2026
LED modules - Safety requirements
Käsitlusala: IEC 62031:2026 specifies safety requirements for LED modules for operation on DC supplies up to 1 500 V or on AC supplies up to 1 000 V. This document does not include requirements for performance characteristics of LED modules.
This document does not apply to:
- LED packages;
- LED modules for automotive lighting;
- OLED modules;
- LED lamps.
This third edition cancels and replaces the second edition published in 2018. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Complete review of the document structure, detailed technical requirements and tests, including but not limited to what is individually described under items b) to i);
b) Clarification of the scope and revision of the applicability of this document to independent and integral LED modules;
c) Updated terms and definitions;
d) Clearer specification for clause general requirements and clause general test requirements;
e) Update of the marking clause, such as marking of control terminals;
f) A full review and update of the electrical safety, thermal safety, and mechanical safety requirements preventing misinterpretation and ambiguity;
g) Updated photobiological safety requirements;
h) Revised and updated fault conditions and abnormal conditions requirements;
i) Removal of the annex relating to conformity testing during manufacture.
This document does not apply to:
- LED packages;
- LED modules for automotive lighting;
- OLED modules;
- LED lamps.
This third edition cancels and replaces the second edition published in 2018. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Complete review of the document structure, detailed technical requirements and tests, including but not limited to what is individually described under items b) to i);
b) Clarification of the scope and revision of the applicability of this document to independent and integral LED modules;
c) Updated terms and definitions;
d) Clearer specification for clause general requirements and clause general test requirements;
e) Update of the marking clause, such as marking of control terminals;
f) A full review and update of the electrical safety, thermal safety, and mechanical safety requirements preventing misinterpretation and ambiguity;
g) Updated photobiological safety requirements;
h) Revised and updated fault conditions and abnormal conditions requirements;
i) Removal of the annex relating to conformity testing during manufacture.
Alusdokumendid:
Asendab: IEC 62031:2018
IEC 62047-52:2026
Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
Käsitlusala: IEC 62047-52:2026 specifies a testing method for measuring device performance and failure strain under biaxial tensile deformation in stretchable MEMS materials. The typical examples of the stretchable MEMS materials are flexible single crystalline silicon structures, MEMS circuit boards, interconnected MEMS on a stretchable substrate. The test piece has a cruciform geometry and the test piece thickness ranges from 1 μm to 100 μm with the same thickness as the actual devices. Since the failure strain can vary depending on loading conditions like uniaxial tension and equi-biaxial tension, a biaxial load is applied to a cruciform test piece with varying strain ratio between two perpendicular loading directions.
Alusdokumendid:
Asendatud standardid
EVS-EN 60749-20-1:2009
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Käsitlusala: This part of IEC 60749 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date.
Alusdokumendid: IEC 60749-20-1:2009; EN 60749-20-1:2009
Asendatud: EVS-EN IEC 60749-20-1:2026
IEC 62031:2018
LED modules for general lighting - Safety specifications
Käsitlusala: IEC 62031:2018 specifies general and safety requirements for light-emitting diode (LED) modules:
- non-integrated LED modules (LEDni modules) and semi-integrated LED modules (LEDsi modules) for operation under constant voltage, constant current or constant power;
- Integrated LED modules (LEDi modules) for use on DC supplies up to 250 V or AC supplies up to 1 000 V at 50 Hz or 60 Hz.
This second edition cancels and replaces the first edition published in 2008, Amendment 1:2012 and Amendment 2:2014. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a. the scope was clarified as well as the wording in several other clauses;
b. the normative references were updated;
c. the definitions for "replaceable LED module", "non-replaceable LED module" and "non-user replaceable LED module" were introduced while other definitions covered by IEC 62504 have been removed;
d. the marking clause was restructured and a table added to provide an informative overview;
e. the marking requirements for built-in LED modules were changed;
f. the entry for the marking with the working voltage was revised;
g. the provisions for terminals and heat management were revised;
h. Annex B was deleted;
i. information for luminaire design with regard to working voltage and water contact was introduced;
j. an abnormal temperature test was introduced.
- non-integrated LED modules (LEDni modules) and semi-integrated LED modules (LEDsi modules) for operation under constant voltage, constant current or constant power;
- Integrated LED modules (LEDi modules) for use on DC supplies up to 250 V or AC supplies up to 1 000 V at 50 Hz or 60 Hz.
This second edition cancels and replaces the first edition published in 2008, Amendment 1:2012 and Amendment 2:2014. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a. the scope was clarified as well as the wording in several other clauses;
b. the normative references were updated;
c. the definitions for "replaceable LED module", "non-replaceable LED module" and "non-user replaceable LED module" were introduced while other definitions covered by IEC 62504 have been removed;
d. the marking clause was restructured and a table added to provide an informative overview;
e. the marking requirements for built-in LED modules were changed;
f. the entry for the marking with the working voltage was revised;
g. the provisions for terminals and heat management were revised;
h. Annex B was deleted;
i. information for luminaire design with regard to working voltage and water contact was introduced;
j. an abnormal temperature test was introduced.
Alusdokumendid:
Asendatud: IEC 62031:2026