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IEC 60191-6-18:2010/COR1:2010

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

General information

Valid from 31.05.2010
Directives or regulations
None

Standard history

Status
Date
Type
Name
28.07.2010
Corrigendum
31.05.2010
Corrigendum
07.01.2010
Main

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