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EVS-EN IEC 60749-5:2024

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

General information
Valid from 01.02.2024
Base Documents
IEC 60749-5:2023; EN IEC 60749-5:2024
Directives or regulations
None

Standard history

Status
Date
Type
Name
01.02.2024
Main
17.07.2017
Main
IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to “virtual junction” with “die”.
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