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prEN IEC 61191-10-2:2026

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate

General information

Draft
Base Documents
91/2120/CDV; prEN IEC 61191-10-2:2026
ICS Groups
31.180 Printed circuits and boards 31.190 Electronic component assemblies
Directives or regulations
None
You can view draft standards in the Commenting portal🡭.

Standard history

Status
Date
Type
Name
Main
prEN IEC 61191-10-2:2026
This part of IEC 61191-10 describes a process used for setting the bonding parameters by measuring time-temperature profile in laser-assisted bonding (LAB) in flip-chip packaging technology.
NOTE Laser-assisted bonding can as well be used in other processes, such as LED bonding, solar-cell bonding, and hermetic sealing of MEMS components.

Required fields are indicated with *

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Standard monitoring

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Standards designation

EVSEstonian standard
ENEuropean standard (published by an CEN or CENELEC)
EN ISOInternational standard adopted as an European standard
ISOInternational Organization for Standardization’s standard
IECInternational Electrotechnical Commission’s standard
HDCENELEC’s harmonisation document
EVS-ENEuropean standard implemented in Estonia
EVS-EN ISOInternational standard adopted in Europe and implemented in Estonia
EVS-EN ISO/IECInternational standard/International electrotechnical standard adopted in Europe and implemented in Estonia
EVS-IECInternational electrotechnical standard implemented in Estonia
EVS-ISO International standard implemented in Estonia
 
A, AMDamedment
+Aa full standard plus the amendment
/Aonly amendment
COR, ACcorrigendum
+CORa full standard plus the corrigendum
NAnational annex
+NAa full standard plus the national annex
/NAonly national annex
TStechnical specification
TRtechnical report
CWAagreement, developed by a CEN or CENELEC
prEVS-EN (etc)draft standard
 
etthe standard is in Estonian only
enthe standard is in English only
et-enthe standard is in Parallel text Estonian-English