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prEN IEC 63378-2-2:2026

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

General information

Draft
Base Documents
47D/1002/CDV; prEN IEC 63378-2-2:2026
Directives or regulations
None
You can view draft standards in the Commenting portal🡭.

Standard history

Status
Date
Type
Name
This part of IEC 63378 specifies three-dimensional (3D) thermal models of PBGA (Plastic Ball Grid Array) and FBGA (Fine pitch Ball Grid Array) packages, utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately.
This model is intended to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.

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Standard monitoring