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EVS-EN 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

General information
Valid from 01.11.2017
Base Documents
IEC 61191-2:2017; EN 61191-2:2017
Directives or regulations
None

Standard history

Status
Date
Type
Name
01.11.2019
Corrigendum
01.11.2017
Main
14.11.2013
Main
IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
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