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IEC 61189-1:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

General information

Valid from 27.03.1997
Directives or regulations
None

Standard history

Status
Date
Type
Name
09.08.2001
Amendment
27.03.1997
Main
This series relates to test methods for printed boards and printed
board assemblies, as well as related materials or component
robustness, irrespective of their method of manufacture.

This part contains test methods for evaluating printed boards and
other forms of interconnection structures. The methods are designed
to achieve uniformity and reproducibility in the procedures and
test methodologies.

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