Skip to main content
Back

IEC 62047-2:2006

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

General information

Valid from 15.08.2006
Directives or regulations
None

Standard history

Status
Date
Type
Name
15.08.2006
Main
Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10  m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

Required fields are indicated with *

*
*
*
PDF
106.71 € incl tax
Paper
106.71 € incl tax
Standard monitoring