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prEN IEC 61249-2-51:2022

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad

General information
Draft
Base Documents
91/1793/CDV; prEN IEC 61249-2-51:2022
Directives or regulations
None
Standard history
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Date
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This standard specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of Base materials for Integrated Circuit Card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This standard is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
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