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EVS-EN ISO 9455-17:2024

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2024)

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Kehtiv alates 01.02.2024
Alusdokumendid
ISO 9455-17:2024; EN ISO 9455-17:2024
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Standardi ajalugu

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Kuupäev
Tüüp
Nimetus
01.02.2024
Põhitekst
08.08.2006
Põhitekst
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.
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