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IEC 62899-202-9:2023

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

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Kehtiv alates 03.08.2023
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Nimetus
03.08.2023
Põhitekst
IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.
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