Infoteenus
31 ELEKTROONIKA
Uued standardid
EVS-EN IEC 60825-2:2026
Lasertoodete ohutus. Osa 2: Kiudoptiliste sidesüsteemide ohutus
Käsitlusala: This document provides requirements and specific guidance for the safe operation and maintenance of optical fibre communication systems (OFCSs). In these systems, optical power is possibly accessible outside the confines of the transmitting equipment and/or at great distance from the optical source.
This document requires the assessment of hazard level at each accessible location of the OFCS as a replacement for product classification according to IEC 60825-1. It applies to the installed OFCS as an engineered, end-to-end assembly for the generation, transfer and receipt of optical radiation arising from lasers, light-emitting diodes (LEDs) or optical amplifiers, in which the transference is by means of optical fibre for communication and/or control purposes.
NOTE 1 Throughout this document, a reference to 'laser' is taken to include LEDs and optical amplifiers.
Individual components and subassemblies that fall under the definition of a laser product are subject to the applicable subclause(s) of IEC 60825-1. This document is applicable to individual components and subassemblies intended to be installed within OFCSs.
This document does not apply to optical fibre systems primarily designed to transmit optical power for applications such as material processing or medical treatment.
In addition to the hazards resulting from laser radiation, OFCSs possibly give rise to other hazards, such as fire.
This document does not address safety issues associated with explosion or fire with respect to OFCSs deployed in explosive atmospheres.
NOTE 2 The hazard presented by optical radiation emerging from a fibre is determined by the wavelength and power emerging from the fibre and also by the optical characteristics of the fibre itself (see Annex A).
This document requires the assessment of hazard level at each accessible location of the OFCS as a replacement for product classification according to IEC 60825-1. It applies to the installed OFCS as an engineered, end-to-end assembly for the generation, transfer and receipt of optical radiation arising from lasers, light-emitting diodes (LEDs) or optical amplifiers, in which the transference is by means of optical fibre for communication and/or control purposes.
NOTE 1 Throughout this document, a reference to 'laser' is taken to include LEDs and optical amplifiers.
Individual components and subassemblies that fall under the definition of a laser product are subject to the applicable subclause(s) of IEC 60825-1. This document is applicable to individual components and subassemblies intended to be installed within OFCSs.
This document does not apply to optical fibre systems primarily designed to transmit optical power for applications such as material processing or medical treatment.
In addition to the hazards resulting from laser radiation, OFCSs possibly give rise to other hazards, such as fire.
This document does not address safety issues associated with explosion or fire with respect to OFCSs deployed in explosive atmospheres.
NOTE 2 The hazard presented by optical radiation emerging from a fibre is determined by the wavelength and power emerging from the fibre and also by the optical characteristics of the fibre itself (see Annex A).
Alusdokumendid: EN IEC 60825-2:2026; IEC 60825-2:2021; IEC 60825-2:2021/COR1:2021
EVS-EN IEC 60444-11:2026
Measurement of quartz crystal unit parameters - Part 11: Standard method for the determination of the load resonance frequency f<sub>L</sub> and the effective load capacitance C<sub>Leff</sub> using automatic network analyzer techniques and error correction
Käsitlusala: IEC 60444-11:2026 defines the standard method of measuring load resonance frequency fL at the nominal value of CL, and the determination of the effective load capacitance CLeff at the nominal frequency for crystals with the figure of merit M > 4.
This edition includes the following significant technical changes with respect to the previous edition:
a) key content of withdrawn IEC TR 60444-4 is reproduced as Annex A;
b) some formulae in the first edition have been corrected.
This edition includes the following significant technical changes with respect to the previous edition:
a) key content of withdrawn IEC TR 60444-4 is reproduced as Annex A;
b) some formulae in the first edition have been corrected.
Alusdokumendid: IEC 60444-11:2026; EN IEC 60444-11:2026
Asendab: EVS-EN 60444-11:2010
EVS-EN IEC 61360-7:2026
Standard data element types with associated classification scheme - Part 7: Data dictionary of cross-domain concepts
Käsitlusala: This part of the EN IEC 61360 specifies the new data dictionary (domain) “IEC 61360-7 - General items” including its generic concepts. The IEC 61360-7 data dictionary provides concepts (dictionary elements e.g. classes, properties) intended for cross-domain use.
This document has the status of a horizontal publication in accordance with IEC Guide 108.
The IEC 61360-7 data dictionary is published in IEC CDD and is available at https://cdd.iec.ch.
This document has the status of a horizontal publication in accordance with IEC Guide 108.
The IEC 61360-7 data dictionary is published in IEC CDD and is available at https://cdd.iec.ch.
Alusdokumendid: IEC 61360-7:2024; EN IEC 61360-7:2026
IEC 62715-6-22:2026
Flexible displays - Part 6-22: Mechanical test methods - Crease and waviness measurement methods for foldable displays
Käsitlusala: IEC 62715-6-22:2026 specifies the standard measurement conditions and methods for determining the surface crease and waviness for the evaluation of foldable displays. The measurement methods are used to specify the extent of geometrical distortions in foldable display surfaces. This document applies to foldable display panels and modules. If the foldable display panel has two or more folding axes, this document applies only to the case that folding axes are parallel. This second edition cancels and replaces the first edition published in 2023. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
- addition of multiple-folding;
- addition of new data analysis logic.
This edition includes the following significant technical changes with respect to the previous edition:
- addition of multiple-folding;
- addition of new data analysis logic.
Alusdokumendid:
Asendab: IEC 62715-6-22:2023
IEC 62899-402-8:2026
Printed electronics - Part 402-8: Printability - Measurement of qualities - Shape pattern dimension
Käsitlusala: IEC 62899-402-8:2026 specifies the measurement methods of the dimensions of the shape patterns in printed electronics. These printed patterns are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for vertical variance in IEC TR 62899‑402‑4 in printed electronics.
NOTE The measurement methods of dimensions of the shape patterns considering three-dimensional characteristics can be developed later after the measurement methods for vertical variance are established.
NOTE The measurement methods of dimensions of the shape patterns considering three-dimensional characteristics can be developed later after the measurement methods for vertical variance are established.
Alusdokumendid:
IEC 61760-4:2026
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Käsitlusala: IEC 61760-4:2026 specifies the classification of moisture sensitive device into moisture sensitivity level related to soldering heat, and provisions for packaging, labelling and handling. It extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases, this document introduces additional moisture sensitivity levels and an alternative method for packaging. This document applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices, and devices for flow (wave) soldering.
NOTE Background of this document and its relation to currently existing standards, e.g. IEC 60749‑20 or J-STD-020F and J-STD-033, are described in the Introduction.
This edition includes the following significant technical changes with respect to the previous edition:
a) The content is updated to cover the classification conditions given in the new editions of J-STD-020F and IEC 60068-2-58.
NOTE Background of this document and its relation to currently existing standards, e.g. IEC 60749‑20 or J-STD-020F and J-STD-033, are described in the Introduction.
This edition includes the following significant technical changes with respect to the previous edition:
a) The content is updated to cover the classification conditions given in the new editions of J-STD-020F and IEC 60068-2-58.
Alusdokumendid:
IEC TS 62564-1:2026
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
Käsitlusala: IEC TS 62564-1:2026 defines the minimum requirements for integrated circuits and semiconductors which are designated as an "aerospace qualified electronic component (AQEC)".
This edition includes the following significant technical changes with respect to the previous edition:
a) addition of optional ADHP PPAP;
b) revision to Annex B; addition of Annex C and Annex D;
c) removal of STACK;
d) general update to referenced standards throughout.
This edition includes the following significant technical changes with respect to the previous edition:
a) addition of optional ADHP PPAP;
b) revision to Annex B; addition of Annex C and Annex D;
c) removal of STACK;
d) general update to referenced standards throughout.
Alusdokumendid:
Asendab: IEC TS 62564-1:2016
IEC TR 63650:2026
Electrochemical capacitor for use in electrical energy storage
Käsitlusala: IEC TR 63650:2026 investigates the primary technological approaches, current applications, and development prospects of electrochemical capacitors (supercapacitors). In particular, this document also analyses the technical solutions and characteristics of electrochemical capacitor applications in the field of Electrical Energy Storage (EES) and provides representative application cases. Then, the testing items of the electrochemical capacitors (supercapacitors) for use in EES are introduced for the cells and modules, respectively.
By collecting the existing standards of electrochemical capacitor , this document identifies the gap between the existing IEC and ISO standards and the actual needs of electrochemical capacitors used in EES and proposes descriptions and a roadmap for future standardization of electrochemical capacitors in the field of EES. This work will promote the rapid progress and broader applications of electrochemical capacitors in the field of EES.
By collecting the existing standards of electrochemical capacitor , this document identifies the gap between the existing IEC and ISO standards and the actual needs of electrochemical capacitors used in EES and proposes descriptions and a roadmap for future standardization of electrochemical capacitors in the field of EES. This work will promote the rapid progress and broader applications of electrochemical capacitors in the field of EES.
Alusdokumendid:
IEC TR 62908-1-3:2026
Touch and interactive displays - Part 1-3: Generic - Overview of pen touch technology
Käsitlusala: IEC TR 62908-1-3:2026, which is a technical report, provides general information on pen touch technology with the aim toward standardization. This document includes an overview of the pen touch technology, critical performance characteristics, issues of characteristics measurements, and other information. The purpose of this document is to provide an overview of the different products available in pen touch technology. The companies and products named in this document do not constitute an endorsement by IEC of these products. This second edition cancels and replaces the first edition published in 2021. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) add writing characteristics as physical properties of interaction between a pen and a surface of a screen;
b) add example of frictional response between paper and pencil, AGL and touch pen, and glass and touch pen;
c) add example of touch display used in the classroom regarding writing and optical characteristics.
This edition includes the following significant technical changes with respect to the previous edition:
a) add writing characteristics as physical properties of interaction between a pen and a surface of a screen;
b) add example of frictional response between paper and pencil, AGL and touch pen, and glass and touch pen;
c) add example of touch display used in the classroom regarding writing and optical characteristics.
Alusdokumendid:
Asendab: IEC TR 62908-1-3:2021
Asendatud standardid
IEC 61760-4:2015
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Käsitlusala: IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging.
This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.
This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.
Alusdokumendid:
Asendatud: IEC 61760-4:2026
IEC TS 62564-1:2016
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
Käsitlusala: IEC TS 62564-1:2016(E) defines the minimum requirements for integrated circuits and semiconductors which are designated as an "aerospace qualified electronic component (AQEC)". This new edition includes the following significant technical changes with respect to the previous edition:
- refers to the latest editions of IEC TS 62239-1 and IEC TS 62686-1, and of other publications;
- adds information regarding components' life expectancy.
- refers to the latest editions of IEC TS 62239-1 and IEC TS 62686-1, and of other publications;
- adds information regarding components' life expectancy.
Alusdokumendid:
Asendatud: IEC TS 62564-1:2026
EVS-EN 60444-11:2010
Measurement of quartz crystal unit parameters - Part 11: Standard method for the determination of the load resonance frequency fL and the effective load capacitance CLeff using automatic network analyzer techniques and error correction
Käsitlusala: This part of IEC 60444 defines the standard method of measuring load resonance frequency fL at the nominal value of CL, and the determination of the effective load capacitance CLeff at the nominal frequency for crystals with the figure of merit M > 4.
Alusdokumendid: IEC 60444-11:2010; EN 60444-11:2010
Asendatud: EVS-EN IEC 60444-11:2026
EVS-EN 60825-2:2004
Lasertoodete ohutus. Osa 2: Kiudoptiliste sidesüsteemide ohutus
Käsitlusala: Provides requirements and specific guidance for the safe use of optical fibre and/or control communication systems where optical power may be accessible at great distance from the optical source. Does not apply to optical fibre systems primarily designed to transmit optical power for applications such as material processing or medical treatment.
Alusdokumendid: IEC 60825-2:2004; EN 60825-2:2004
Asendatud: EVS-EN IEC 60825-2:2026
EVS-EN 60825-2:2004/A1:2007
Lasertoodete ohutus. Osa 2: Kiudoptiliste sidesüsteemide ohutus
Käsitlusala: Provides requirements and specific guidance for the safe operation and maintenance of optical fibre communication systems (OFCS). In these systems optical power may be accessible outside the confinements of transmitting equipment or at great distance from the optical source. This standard requires the assessment of hazard levels at accessible locations as a replacement for classification according to EN 60825-1. It applies to the complete installed end-to-end OFCS, including its components and subassemblies that generate or amplify optical radiation. Individual components and subassemblies that are sold only to OEM vendors for incorporation into a complete installed end-to-end OFCS need not be assessed to this standard, since the final OFCS should itself be assessed according to this standard. The objective of this Part 2 of EN 60825 is to: - protect people from optical radiation resulting from OFCS; - provide requirements for manufacturers, installation organizations, service organizations and operating organizations in order to establish procedures and supply information so that proper precautions can be adopted; - ensure adequate warnings are provided to individuals regarding the potential hazards associated with OFCS through the use of signs, labels and instructions.
Alusdokumendid: IEC 60825-2:2004/A1:2006; EN 60825-2:2004/A1:2007
Asendatud: EVS-EN IEC 60825-2:2026
EVS-EN 60825-2:2004/A2:2010
Lasertoodete ohutus. Osa 2: Kiudoptiliste sidesüsteemide ohutus
Käsitlusala: Provides requirements and specific guidance for the safe use of optical fibre and/or control communication systems where optical power may be accessible at great distance from the optical source. Does not apply to optical fibre systems primarily designed to transmit optical power for applications such as material processing or medical treatment.
Alusdokumendid: IEC 60825-2:2004/A2:2010; EN 60825-2:2004/A2:2010
Asendatud: EVS-EN IEC 60825-2:2026
IEC 61760-4:2015/AMD1:2018
Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Käsitlusala: Amendment for IEC 61760-4:2015
Alusdokumendid:
Asendatud: IEC 61760-4:2026
IEC 61760-4:2015+AMD1:2018 CSV
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
Käsitlusala: IEC 61760-4:2015+A1:2018 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.
This consolidated version consists of the first edition (2015) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
This consolidated version consists of the first edition (2015) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.
Alusdokumendid:
EVS-EN 60931-3:2001
Mitte-iseparanevat tüüpi paralleel-jõukondensaatorid vahelduvvooolusüsteemidele nimipingega kuni 1 kV. Osa 3: Sisemised sulavkaitsmed
Käsitlusala: This part of IEC 931 applies to internal fuses which are designed to isolate faulty capacitor elements or a capacitor unit, in order to allow operation of the remaining parts of that capacitor unit and the bank in which the capacitor unit is connected. Such fuses are not a substitute for a switching device such as a circuit-breaker, or for external protection of the capacitor bank or any part thereof.
Alusdokumendid: IEC 931-3:1996; EN 60931-3:1996
IEC TR 62908-1-3:2021
Touch and interactive displays - Part 1-3: General introduction of pen touch technology
Käsitlusala: IEC TR 62908-1-3:2021, which is a technical report, provides general information on pen touch technology with the aim toward standardization. This document includes an overview of the pen touch technology, critical performance characteristics, issues of characteristics measurements, and other information. The purpose of this documents is to provide an overview of the different products available in pen touch technology.
Alusdokumendid:
Asendatud: IEC TR 62908-1-3:2026
IEC 62715-6-22:2023
Flexible display devices - Part 6-22: Crease and waviness measurement methods
Käsitlusala: IEC 62715-6-22:2023 specifies the standard measurement conditions and methods for determining the surface crease and waviness for the evaluation of foldable displays. The measurement methods are used to specify the extent of geometrical distortions in foldable display surfaces. This document applies to foldable display panels and modules (e.g. in-folding and out-folding) with one axis.
Alusdokumendid:
Asendatud: IEC 62715-6-22:2026
EVS-EN IEC 63215-2:2023
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices
Käsitlusala: IEC 63215-2:2023 applies to the die attach materials and joining system applied to discrete type power electronic devices.
This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index).
The test method specified in this document is not intended to evaluate power semiconductor devices themselves.
The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages.
NOTE The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup.
This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index).
The test method specified in this document is not intended to evaluate power semiconductor devices themselves.
The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages.
NOTE The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup.
Alusdokumendid: IEC 63215-2:2023; EN IEC 63215-2:2023
Kavandid
prEN IEC 61076-1:2026
Connectors for electrical and electronic equipment - Product requirements - Part 1: Generic specification
Käsitlusala: This part of IEC 61076 establishes uniform specifications and technical information for connectors. It is applicable to the family of connectors for use in electrical and electronic equipment. It contains, or gives reference to, the terms, definitions, symbols, test schedules and information relating to connectors.
Connectors designed for use at radio frequencies are not covered.
It shall be used in conjunction with IEC GUIDE 109:2003 that advocates the need to minimize the impact of a product on the natural environment throughout the product life cycle.
It is understood that some materials permitted by this specification and in manufacturing and assembly processes may have a negative environmental impact. As technological advances lead to acceptable alternatives for these materials, they shall be eliminated from this specification. Inappropriate manufacturing processes should be replaced by a product design that features easy maintainability and disassembly.
In the event of conflict between this part of IEC 61076 and the sectional product specification, the requirements of the sectional product specification prevail.
Connectors designed for use at radio frequencies are not covered.
It shall be used in conjunction with IEC GUIDE 109:2003 that advocates the need to minimize the impact of a product on the natural environment throughout the product life cycle.
It is understood that some materials permitted by this specification and in manufacturing and assembly processes may have a negative environmental impact. As technological advances lead to acceptable alternatives for these materials, they shall be eliminated from this specification. Inappropriate manufacturing processes should be replaced by a product design that features easy maintainability and disassembly.
In the event of conflict between this part of IEC 61076 and the sectional product specification, the requirements of the sectional product specification prevail.
Alusdokumendid: 48B/3210/CDV; prEN IEC 61076-1:2026
prEN IEC 61076-3:2026
Connectors for electrical and electronic equipment - Product requirements - Part 3: Rectangular connectors - Sectional specification
Käsitlusala: This part of IEC 61076 establishes uniform specifications and technical information for rectangular connectors. It is applicable to the subfamily of rectangular connectors for use in electrical and electronic equipment and should be used in conjunction with the generic specification IEC 61076-1:2024 for product requirements as the basis for preparation of consistent detail product specifications for rectangular connectors.
NOTE 1 The quality assessment requirements for connectors according to the IEC 61076 series are detailed in IEC 62197-1:2006 [1].
NOTE 2 A detail quality specification, future IEC 62197-3-1XX should be prepared, based on the blank detail quality specification for rectangular connectors, future IEC 62197-3-001:2006 [2], and should be used in conjunction with the detail product specification IEC 61076-3-1XX.
NOTE 1 The quality assessment requirements for connectors according to the IEC 61076 series are detailed in IEC 62197-1:2006 [1].
NOTE 2 A detail quality specification, future IEC 62197-3-1XX should be prepared, based on the blank detail quality specification for rectangular connectors, future IEC 62197-3-001:2006 [2], and should be used in conjunction with the detail product specification IEC 61076-3-1XX.
Alusdokumendid: 48B/3211/CDV; prEN IEC 61076-3:2026
prEN IEC 62635:2026
Assessment of material recyclability rate and material recoverability rate of products
Käsitlusala:
IEC 62635 provides a method to calculate the material recyclability rate of electrical and electronic equipment (EEE) during the design phase using material recycling rate data based on EoL treatment scenarios. It also provides a method to calculate material recoverability rate based on material recovery rate data. This document sets up criteria and a format to describe the EoL treatment scenarios. Additionally, the method can be also applied for the calculation of recyclability and recoverability of materials of interest such as CRMs.
To achieve the above, this document addresses:
– A default EoL treatment scenario for material recycling and for material recovery,
– Examples of EoL treatment scenarios and the corresponding material recovery and material recycling rates,
– Provisions for product information from manufacturers to EoL treatment operators to improve material recycling and recovery rates,
– Provisions for EoL treatment information from EoL treatment operators to manufacturers to build EoL treatment scenarios.
This document does not address the recovery of products and parts for reuse and product packaging.
Alusdokumendid: 111/886/CDV; prEN IEC 62635:2026
prEN IEC 60384-1:2026
Fixed capacitors for use in electronic equipment - Part 1: Generic specification
Käsitlusala: This part of IEC 60384 is a generic specification and is applicable to fixed capacitors for use in electronic equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
Alusdokumendid: 40/3302/CDV; prEN IEC 60384-1:2026